Patents by Inventor Travis L. Kerby

Travis L. Kerby has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10342126
    Abstract: A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: July 2, 2019
    Assignee: HARRIS CORPORATION
    Inventors: Louis Joseph Rendek, Jr., Travis L. Kerby, Casey Philip Rodriguez
  • Patent number: 9763324
    Abstract: A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: September 12, 2017
    Assignee: HARRIS CORPORATION
    Inventors: Louis Joseph Rendek, Jr., Travis L. Kerby, Casey Philip Rodriguez
  • Patent number: 9681543
    Abstract: A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: June 13, 2017
    Assignee: HARRIS CORPORATION
    Inventors: Louis Joseph Rendek, Jr., Travis L. Kerby, Casey Philip Rodriguez, Michael Raymond Weatherspoon
  • Patent number: 9293438
    Abstract: A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: March 22, 2016
    Assignee: HARRIS CORPORATION
    Inventors: Louis Joseph Rendek, Jr., Casey Philip Rodriguez, Travis L. Kerby, Michael Raymond Weatherspoon
  • Publication number: 20150009644
    Abstract: A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.
    Type: Application
    Filed: July 3, 2013
    Publication date: January 8, 2015
    Inventors: Louis Joseph RENDEK, JR., Casey Philip Rodriguez, Travis L. Kerby, Michael Raymond Weatherspoon
  • Patent number: 8844125
    Abstract: A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: September 30, 2014
    Assignee: Harris Corporation
    Inventors: Louis Joseph Rendek, Jr., Travis L. Kerby, Casey Philip Rodriguez
  • Patent number: 7343675
    Abstract: A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: March 18, 2008
    Assignee: Harris Corporation
    Inventors: C. W. Sinjin Smith, Paul B. Jaynes, Charles J. Newton, Travis L. Kerby