Abstract: A system for measuring a hole includes a hole measuring device, processor(s) and a memory. The hole measuring device includes an end portion and an imaging portion. The end portion is configured to be inserted in a hole and includes at least first and second outer contact surface portions configured to be biased against the inner surface of the hole such that a contact distance between the first and second outer contact surface portions varies depending on the diameter of the hole. The end portion includes one or more reference surface portions (e.g., which are each configured to move when a corresponding outer contact surface portion moves). The imaging portion acquires an image of the one or more reference surface portions. The acquired image is used to determine relative positions of the one or more reference surface portions, which in turn are used to determine the diameter of the hole.

Abstract: An inductive linear encoder configured to measure a relative position between two elements along a measuring axis direction includes a scale including a periodic scale pattern and a detector portion configured to move along the measuring axis direction relative to the periodic scale pattern, wherein the detector portion and the scale are separated by a gap. The detector portion includes a field generating portion configured to generate a changing magnetic flux, and a sensing portion configured to provide detector signals which respond to a local effect on the changing magnetic flux provided by adjacent signal modulating elements of the scale pattern. The encoder includes one or more actuators coupled to the detector portion and configured to be electronically controlled to adjust a position of the detector portion so as to adjust the gap based at least in part on the detector signals from the sensing portion.

Abstract: An inductive linear encoder configured to measure a relative position between two elements along a measuring axis direction includes a scale including a periodic scale pattern and a detector portion configured to move along the measuring axis direction relative to the periodic scale pattern, wherein the detector portion and the scale are separated by a gap. The detector portion includes a field generating portion configured to generate a changing magnetic flux, and a sensing portion configured to provide detector signals which respond to a local effect on the changing magnetic flux provided by adjacent signal modulating elements of the scale pattern. The encoder includes one or more actuators coupled to the detector portion and configured to be electronically controlled to adjust a position of the detector portion so as to adjust the gap based at least in part on the detector signals from the sensing portion.

Abstract: A system for measuring a hole includes a hole measuring device, processor(s) and a memory. The hole measuring device includes an end portion and an imaging portion. The end portion is configured to be inserted in a hole and includes at least first and second outer contact surface portions configured to be biased against the inner surface of the hole such that a contact distance between the first and second outer contact surface portions varies depending on the diameter of the hole. The end portion includes one or more reference surface portions (e.g., which are each configured to move when a corresponding outer contact surface portion moves). The imaging portion acquires an image of the one or more reference surface portions. The acquired image is used to determine relative positions of the one or more reference surface portions, which in turn are used to determine the diameter of the hole.

Abstract: A coordinate measuring machine (CMM) system is provided including utilization of a vision probe (e.g., for performing operations for determining and/or measuring surface profiles of workpieces, etc.) The angular orientation of the vision probe may be adjusted using a rotation mechanism so that the optical axis of the vision probe is directed toward an angled surface of a workpiece (e.g., in some implementations the optical axis may be approximately perpendicular to the angled workpiece surface). X-axis, y-axis and z-axis slide mechanisms (e.g., moving in mutually orthogonal directions) may in conjunction move the vision probe to acquisition positions along an image stack acquisition axis (which may approximately coincide with the optical axis) for acquiring a stack of images of the angled workpiece surface. Focus curve data may be determined from analysis of the image stack, which indicates 3-dimensional positions of surface points on the angled surface of the workpiece.

Abstract: A coordinate measuring machine (CMM) system is provided including utilization of a vision probe (e.g., for performing operations for determining and/or measuring surface profiles of workpieces, etc.) The angular orientation of the vision probe may be adjusted using a rotation mechanism so that the optical axis of the vision probe is directed toward an angled surface of a workpiece (e.g., in some implementations the optical axis may be approximately perpendicular to the angled workpiece surface). X-axis, y-axis and z-axis slide mechanisms (e.g., moving in mutually orthogonal directions) may in conjunction move the vision probe to acquisition positions along an image stack acquisition axis (which may approximately coincide with the optical axis) for acquiring a stack of images of the angled workpiece surface. Focus curve data may be determined from analysis of the image stack, which indicates 3-dimensional positions of surface points on the angled surface of the workpiece.