Abstract: An information handling system determines a fan speed value based on a current fan speed value and at least one factor, and transmits the fan speed value instead of the current fan speed value to an operating system scheduler. The system may also determine a fan acoustic level based on the fan speed value, and perform an action based on the fan acoustic level.

Abstract: A quality of a mechanical connection within an information handling system may be inferred based on pressure. An electronic pressure sensor is disposed between two components operating within the information handling system. The electronic pressure sensor generates an output signal in response to a clamping pressure and/or clamping force between the two components. Performance of a processor operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. A speed of a cooling fan operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. Any internal components operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force.

Abstract: A hot/cold aisle containment system includes a frame structure partially covered by one or more panels to define an interior space, at least one electronic equipment enclosure installed at an end of the frame structure, an adjustable wall assembly positionable against a side of the at least one electronic equipment enclosure, and at least one mounting rail attached to the frame structure to permit forward and rearward adjustment of the adjustable wall assembly.

Abstract: A cooling system for cooling components in an information handling system contained in a portable chassis comprises a die plate for receiving heat from a component, a heat pipe for transferring heat from the die plate to a single heat exchanger, a fan for generating an airflow across the heat exchanger and a thermal battery. The heat pipe comprises at least one curvature and the thermal battery is coupled to the die plate and has a length and a width such that the thermal battery is in contact with the heat pipe from the die plate to a point past the at least one curvature. The thermal battery may be formed from a thermally conductive material, be a vapor chamber or otherwise facilitate heat transfer to a heat pipe from the die plate to a point past the curvature for improved cooling.

Abstract: A quality of a mechanical connection within an information handling system may be inferred based on pressure. An electronic pressure sensor is disposed between two components operating within the information handling system. The electronic pressure sensor generates an output signal in response to a clamping pressure and/or clamping force between the two components. Performance of a processor operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. A speed of a cooling fan operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. Any internal components operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force.

Abstract: A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.

Abstract: A cooling system for cooling components in an information handling system contained in a portable chassis comprises a die plate for receiving heat from a component, a heat pipe for transferring heat from the die plate to a single heat exchanger, a fan for generating an airflow across the heat exchanger and a thermal battery. The heat pipe comprises at least one curvature and the thermal battery is coupled to the die plate and has a length and a width such that the thermal battery is in contact with the heat pipe from the die plate to a point past the at least one curvature. The thermal battery may be formed from a thermally conductive material, be a vapor chamber or otherwise facilitate heat transfer to a heat pipe from the die plate to a point past the curvature for improved cooling.

Abstract: A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.

Abstract: A quality of a mechanical connection within an information handling system may be inferred based on pressure. An electronic pressure sensor is disposed between two components operating within the information handling system. The electronic pressure sensor generates an output signal in response to a clamping pressure and/or clamping force between the two components. Performance of a processor operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. A speed of a cooling fan operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. Any internal components operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force.

Abstract: A quality of a mechanical connection within an information handling system may be inferred based on pressure. An electronic pressure sensor is disposed between two components operating within the information handling system. The electronic pressure sensor generates an output signal in response to a clamping pressure and/or clamping force between the two components. Performance of a processor operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. A speed of a cooling fan operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. Any internal components operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force.

Abstract: A method for regulating power dissipation at an information handling system may include determining a present value of a first parameter, the first parameter controlling an operating frequency, frequency boost, and a supply voltage at a central processing unit. The method may further include determining a present value of a second parameter, the second parameter defining a user's preference for optimizing operation of the system for noise level, skin temperature, and performance. The method may further include determining that a program executing at the system is specified at a list of software applications. In response to determining that a skin temperature of the system exceeds a threshold, the first parameter may be adjusted to reduce power dissipation of the CPU by a first amount if the value of the second parameter is equal to a first value. The first parameter may be adjusted by a second amount if the present value of the second parameter is equal to a second value.

Abstract: Performance of a system may be boosted with a boost dock that seals fan interfaces to improve airflow through an information handling system. An apparatus may include a first port configured to seal a first interface between the apparatus and an information handling system. The apparatus may also include a first blower configured to receive ambient air as cool intake air and to blow the cool intake air into the information handling system through the first interface sealed by the first port. The apparatus may further include a second blower configured to receive warm exhaust air from the information handling system through the first interface sealed by the first port and to blow the warm exhaust air out of the apparatus. A method may include steps of sealing a first interface, receiving ambient air, blowing cool intake air, receiving warm exhaust air, and blowing warm exhaust air.

Abstract: A system and method for dynamically adjusting a critical temperature threshold of non-volatile memory to ensure full capture of information to non-volatile memory before the information handling system hibernates. If the operating temperature of the non-volatile memory reaches a critical temperature threshold, a controller determines the memory size of information in volatile memory. If there is a maximum memory size, the controller uses the default critical temperature threshold as the critical temperature threshold and initiates a process to write information to the non-volatile memory and hibernates the system. If there is less than the maximum memory size, the controller may dynamically increase the critical temperature threshold based on the memory size such that the information in volatile memory can be written to the non-volatile memory before the information handling system hibernates.

Abstract: An information handling system, including a substrate including a plurality of exposed electrical components on a top surface of the substrate; a bare die positioned on the top surface of the substrate; a gasket positioned on the top surface of the substrate, the gasket is non-electrically conductive; and an electrically conductive thermal interface material (TIM) positioned on a top surface of the bare die, wherein a top surface of the gasket and a top surface of the electrically conductive TIM are substantially flush, wherein the top surface of the electrically conductive TIM and the top surface of the gasket are opposite the top surface of the substrate, wherein the gasket inhibits contact between the electrically conductive TIM and the exposed electrical components.

Abstract: A data processing equipment structure includes a plurality of sidewalls and a ceiling panel, which, together, define an enclosed space. The structure further includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row within the enclosed space. At least one separation panel divides the enclosed space into a front plenum at a front side of the row and a rear plenum at a rear side of the row. Cool air in the front plenum is isolated from heated exhaust air in the rear plenum.

Abstract: A data processing equipment structure includes a plurality of sidewalls and a ceiling panel, which, together, define an enclosed space. The structure further includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row within the enclosed space. At least one separation panel divides the enclosed space into a front plenum at a front side of the row and a rear plenum at a rear side of the row. Cool air in the front plenum is isolated from heated exhaust air in the rear plenum.

Abstract: Controlling an activation status of a proportional-integral-derivative (PID) controller for an information handling system cooling system, such as the on/off status of the PID controller, can reduce power consumption and processing and memory requirements for such a system. A decrease in resource consumption can be realized by deactivating the PID controller during certain periods and activating the PID controller during others. For example, the PID controller can be deactivated when a temperature of a system component falls below a threshold temperature and activated when the temperature of the system component rises above the threshold temperature.

Abstract: Adjusting a cooling fan speed control profile to account for system implementation factors, such as ambient temperature and usage history, can optimize power consumption and reduce the volume and variation of sound generated by shifts in fan speed in response to changes in system and component temperature. Adjusting a cooling fan speed control profile may include adjusting a maximum fan speed based on an ambient temperature or component temperature of the information handling system.

Abstract: A system provides cooling to a storage device, such as solid-state drive, installed within a sealed compartment of an IHS (Information Handling System). The heat pipe extends between the storage device and a fan housing that seals a cooling fan in a physically isolated compartment from the sealed compartment of the IHS. A plurality of clips allow the heat pipe to be removably secured to an outer surface of the fan housing. A cooling plate is used to removably secure the heat pipe to a surface of the storage device. Once installed, the heat pipe transfers heat directly from the surface of the storage device to the outer surface of the sealed fan housing. The heat pipe may be uninstalled by removing screws that secure the cooling plate to the storage device and the heat pipe to the fan housing, allowing the storage device to be removed as needed.

Abstract: Control signals, such as PWM control signals, can be used to control aspects of a cooling system and can be generated using proportional-integral-derivative (PID) control. PID control systems for cooling systems are designed based on default environmental and system characteristics and pre-programmed for operation prior to delivery to customers or end users. Changes in environmental and system characteristics, such as component aging, environmental variations, and variation in manufacturing from system to system, such as heat sink effectiveness and application of thermal pastes, can impact system level performance of the control system. Adjusting gain parameters for the P, I, and D components of a PID control signal can reduce negative impact on system performance resulting from such changes and allow the control system to better adjust to external factors.