Abstract: A heat transfer system includes a fuel cell module that produces heat and water, and a thermal energy storage module that stores the heat produced by the fuel cell module. The thermal energy storage module includes a phase-change material. A conduit couples the fuel cell module to the thermal energy storage module. The conduit is oriented to channel the water produced by the fuel cell module through the thermal energy storage module.

Abstract: An apparatus for creating a musical composition comprising an audio interface, and audio converter module, and a multi-track compositor module is disclosed. The audio interface operably receives audio from an audio input device and outputting audio to an audio output device. The audio converter module is operably connected to the audio interface to convert audio received via the audio interface into an audio track having one or more partitions. The multi-track compositor module is configured to receive a first audio track and a second audio track and automatically score each partition of the first and second audio tracks based on one or more criteria. The multi-track compositor module is then configured to construct a third audio track from the partitions of the first and second audio tracks based on the scores for each partition. A method is also provided.

Abstract: An apparatus for creating a musical composition comprising an audio interface, an audio converter and a live looping recording session is disclosed. The audio interface operably receives audio from an input device and outputs audio to an audio output device. The audio converter module is operably connected to the audio interface to convert audio received via the audio interface into an audio track. The recording session module is configured to repeatedly playback a live loop that includes at least a portion of a first audio track, and to add at least a portion of a second audio track to the live loop during repeated playback. The first audio track may be a pre-existing track stored in a data storage medium. The recording session module may be configured to add at least a portion of a third audio track to the live loop during playback, which may be automatically generated based on one or more musical criteria of the first or second tracks.

Abstract: A collapsible shipping container includes a floor, a roof, and a pair of bifolding sidewalls, that collapse accordion style to place the sidewalls and roof in a configuration wherein the roof is collapsed onto the sidewalls, and the sidewalls are collapsed onto the floor. The container further includes a pair of end walls having upper and lower end wall sections. The upper end wall sections may be lowered by activation of a power source to lie on the roof in the collapsed configuration. Collapse and erection of the shipping container may be accomplished with the aid of auxiliary equipment, such as a fork lift.

Abstract: The present invention relates to a novel bacterium Yersinia entomophaga MH96 as deposited at DSMZ on 4 May 2006 and designated accession no. DSM 18238. The present invention also relates to substances obtained or derived from Yersinia entomophaga MH96, which retain biopesticide activity. Methods for protecting a plant from pest infestation which include applying to the plant or its environment an effective amount of Yersinia entomophaga MH96 or a product delivered from the bacterium are also described.

Abstract: A composition and methods of production are described including fungal material, a solid substrate and a biopolymer composition. The composition is described as being stable when stored for at least 7 months and also reduces dust losses normally attributed to fungal compositions. Uses are described for the composition including pest and weed treatments.

Abstract: A collapsible shipping container includes a floor, a roof, and a pair of bifolding sidewalls, that collapse accordion style to place the sidewalls and roof in a configuration wherein the roof is collapsed onto the sidewalls, and the sidewalls are collapsed onto the floor. The container further includes a pair of end walls having upper and lower end wall sections. The upper end wall sections may be lowered by activation of a power source to lie on the roof in the collapsed configuration. Collapse and erection of the shipping container may be accomplished with the aid of auxiliary equipment, such as a fork lift.

Abstract: An invention is provided for a platen for use in a CMP system. The platen includes an inner set of pressure sub regions capable of providing pressure to a polishing pad disposed above the platen. Each of the inner pressure sub regions is disposed below a wafer and within a circumference of the wafer. In addition, the platen includes an outer set of pressure sub regions capable of providing pressure to a polishing pad. Each of the outer set of pressure sub regions is disposed below the wafer and outside the circumference of the wafer. In this manner, the outer set of pressure sub regions is capable of shaping the polishing pad to achieve a particular removal rate.

Abstract: An invention is provided for a chemical mechanical planarization apparatus for processing 300 millimeter wafers. The CMP apparatus includes a polishing belt having a belt tension in a range of about 3000 lbs to 4000 lbs. In addition, a platen is disposed below the polishing belt at a positive platen height. The platen includes at least three air pressure zones, with each air pressure zone being capable of providing air pressure to a backside of the polishing belt. The platen can include, for example, eight air pressure zones. In this aspect, a second air pressure zone adjacent to a first outermost air pressure zone provides an air pressure in a range of about 30 psi to 50 psi, such as about 34 psi. In addition, a third air pressure zone a fourth pressure zone can each provide an air pressure in a range of about 4 psi to 13 psi, such as about 7 psi. In this aspect, the remaining air pressure zones can be set to 0 psi, which conserves fluid consumption.

Abstract: A platen is disclosed. The platen includes a support surface for supporting a portion of a linear polishing belt during a chemical mechanical polishing (CMP) operation. The platen also includes a plurality of fluid outlets oriented throughout the support surface. The orientation defines an asymmetric pattern where each of the plurality of fluid outlets is capable of outputting a controlled fluid toward an underside of the linear polishing belt.

Abstract: A platen is provided for use in a chemical mechanical planarization (CMP) system. The platen includes at least one fluid output zone having a plurality of fluid outlets, the at least one fluid output zone being disposed below a polishing pad and being capable of providing fluid pressure to the polishing pad. The platen also includes at least one fluid input zone having a plurality of fluid inlets, the at least one fluid input zone being disposed below the polishing pad and being capable of removing the fluid pressure. The platen is capable of managing fluid pressure applied to the polishing pad to achieve a particular polishing profile during a CMP operation.

Abstract: An invention is provided for a CMP apparatus that enhances removal rate uniformity. The CMP apparatus includes a polishing belt disposed below a carrier head that is capable of applying a wafer to the polishing belt. Also included is a platen disposed below the polishing belt. The platen includes a circular shim section disposed on the top surface of the platen. The circular shim section is higher than the top surface of the platen. When using this configuration, increasing pressure to the backside of the polishing belt decreases the edge removal rate of the wafer. Conversely, decreasing pressure to the backside of the polishing belt increases the edge removal rate of the wafer.

Abstract: An invention is provided for a platen for use in a CMP system. The platen includes an inner set of pressure sub regions capable of providing pressure to a polishing pad disposed above the platen. Each of the inner pressure sub regions is disposed below a wafer and within a circumference of the wafer. In addition, the platen includes an outer set of pressure sub regions capable of providing pressure to a polishing pad. Each of the outer set of pressure sub regions is disposed below the wafer and outside the circumference of the wafer. In this manner, the outer set of pressure sub regions is capable of shaping the polishing pad to achieve a particular removal rate.