Abstract: Methods, systems, and apparatuses for removing dies attached to a support element are described. The support element has a first surface to which the dies are attached and a second surface that opposes the first surface. In a first example, a first vacuum is applied to the second surface outside an area defined on the second surface. At least one force element applies a force to the second surface inside the area, thereby moving a plurality of dies with respect to other dies. In a second example, heat is applied to an adhesive between the first surface and the plurality of dies to at least partially deactivate the adhesive. A second vacuum is applied to the plurality of dies to remove the plurality of dies from the first surface.

Abstract: A method, system, and apparatus for transferring dies to respective substrates is described. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously or consecutively. Dies are loaded in a channel of a die application device. The dies are moved through the channel using any of a variety of means, such as gravity, air, vibration, a brush, a spring, etc. The die application device dispenses the dies onto respective substrates. In an aspect, the die application device independently dispenses each of the dies. In another aspect, the die application device dispenses multiple dies at a time.