Patents by Inventor Trebor Heminway

Trebor Heminway has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder preform for low heat stress laser solder attachment
    Patent number: 7410088
    Abstract: A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: August 12, 2008
    Assignee: Matsushita Electric Industrial, Co., Ltd.
    Inventors: Trebor Heminway, Brian Massey, Michael Powers, Russel S. Sossong
  • Solder preform for low heat stress laser solder attachment
    Publication number: 20050265669
    Abstract: A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.
    Type: Application
    Filed: July 6, 2005
    Publication date: December 1, 2005
    Inventors: Trebor Heminway, Brian Massey, Michael Powers, Russel Sossong
  • Solder preform for low heat stress laser solder attachment
    Publication number: 20050051598
    Abstract: A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.
    Type: Application
    Filed: September 5, 2003
    Publication date: March 10, 2005
    Inventors: Trebor Heminway, Brian Massey, Michael Powers, Russel Sossong