Abstract: Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

Abstract: A quantum computing system can include one or more classical processors. The quantum computing system can include quantum hardware including one or more qubits. The quantum computing system can include a chamber mount configured to support the quantum hardware. The quantum computing system can include a vacuum chamber configured to receive the chamber mount and dispose the quantum hardware in a vacuum. The vacuum chamber can form a cooling gradient from an end of the vacuum chamber to the quantum hardware. The quantum computing system can include a plurality of flex circuit boards including one or more signal lines. Each of the plurality of flex circuit boards can be configured to transmit signals by the one or more signal lines through the vacuum chamber to couple the one or more classical processors to the quantum hardware.

Abstract: A flex circuit board can be used in transmitting signals in a quantum computing system. The flex circuit board can include at least one dielectric layer and at least one superconducting layer disposed on a surface of the at least one dielectric layer. The at least one superconducting layer can include a superconducting material. The superconducting material can be superconducting at a temperature less than about 3 kelvin. The flex circuit board can have at least one metal structure electroplated onto the at least one superconducting layer.

Abstract: A T-joint connector can be useful for connecting one or more flex circuit boards to quantum hardware including one or more qubits. The T-joint connector can include one or more flex circuit boards. Each of the one or more flex circuit boards can include one or more signal lines and one or more spring interconnects including a superconducting material. The one or more spring interconnects can be coupled to the one or more signal lines. The one or more spring interconnects can be configured to couple the one or more signal lines to one or more signal pads disposed on a mounting circuit board associated with the quantum hardware. The superconducting material can be superconducting at a temperature less than about 3 kelvin.

Abstract: An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

Abstract: Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.

Abstract: A laminated circuit assembly for filtering signals in one or more signal lines in, for instance, a quantum computing system is provided. In one example, the laminated circuit assembly includes one or more signal lines disposed within a substrate in a first direction. The laminated circuit assembly includes a dielectric portion of the substrate. The laminated circuit assembly includes a filter portion of the substrate extending in a first direction and containing a frequency absorbent material providing less attenuation to a first signal of a first frequency than to a second signal of a second, higher frequency. The filter portion is configured to attenuate infrared signals passing through the one or more signal lines.

Abstract: A body fluid sampling system for use on a tissue site includes a drive force generator and one or more microneedles operatively coupled to the drive force generator. Each of a microneedle has a height of 500 to 2000 ?m and a variable tapering angle of 60 to 90°. A sample chamber is coupled to the one or more microneedles. A body fluid is created when the one or more microneedles pierces a tissue site flows to the sample chamber for glucose detection and analysis.

Abstract: A microelectromechanical micromotion amplifier generates a controlled lateral motion in response to a small deformation in the axial direction of a MEM beam or body. Lateral motion is produced by buckling of one or more long slender beams, the buckling motion being relatively large with respect to the axial motion which causes such lateral motion. The beams may be designed with a slight asymmetry to achieve gradual buckling in a desired direction. The device is capable of amplifying a driving motion in the range of 1-5 micrometers to produce a transverse motion in the range of 50-200 micrometers.

Abstract: A process is described for manufacturing submicron, ultra-high aspect ratio microstructures using a trench-filling etch masking technique. Deep trenches are etched into a substrate, the trenches are filled with an appropriate trench-filling material, and deep etching into the substrate is carried out with the trench-filling material serving as a mask.