Patents by Inventor Trent Johnson
Trent Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230071114Abstract: Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.Type: ApplicationFiled: November 11, 2022Publication date: March 9, 2023Inventors: John L. Schumann, Nole D. German, Trent A. Johnson, Duane M. Jelkin, Matthew S. Lang, Ryan N. Ruzicka, Forrest A. Cravens, Todd A. Peter, Zachary A. Pokornowski
-
Patent number: 11521785Abstract: Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.Type: GrantFiled: November 22, 2019Date of Patent: December 6, 2022Assignee: Hutchinson Technology IncorporatedInventors: John L. Schumann, Nole D. German, Trent A. Johnson, Duane M. Jelkin, Matthew S. Lang, Ryan N. Ruzicka, Forrest A. Cravens, Todd A. Peter, Zachary A. Pokornowski
-
Publication number: 20200090854Abstract: Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.Type: ApplicationFiled: November 22, 2019Publication date: March 19, 2020Inventors: John L. Schumann, Nole D. German, Trent A. Johnson, Duane M. Jelkin, Matthew S. Lang, Ryan N. Ruzicka, Forrest A. Cravens, Todd A. Peter, Zachary A. Pokomowski
-
Publication number: 20190325327Abstract: There is a need for solutions that perform predictive data analysis using a value-based predictive input.Type: ApplicationFiled: April 17, 2019Publication date: October 24, 2019Inventors: Mark Francis Blanchette, Robert James Stillwell, Trent Johnson
-
Patent number: 10147449Abstract: Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.Type: GrantFiled: November 20, 2017Date of Patent: December 4, 2018Assignee: Hutchinson Technology IncorporatedInventors: Scott J. Cray, John L. Schumann, Trent A. Johnson, Luke E. Rose
-
Publication number: 20180075870Abstract: Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.Type: ApplicationFiled: November 20, 2017Publication date: March 15, 2018Inventors: Scott J. Cray, John L. Schumann, Trent A. Johnson, Luke E. Rose
-
Patent number: 9824704Abstract: Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.Type: GrantFiled: February 25, 2016Date of Patent: November 21, 2017Assignee: Hutchinson Technology IncorporatedInventors: Scott J. Cray, John L. Schumann, Trent A. Johnson, Luke E. Rose
-
Patent number: 9443547Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.Type: GrantFiled: August 25, 2014Date of Patent: September 13, 2016Assignee: Hutchinson Technology IncorporatedInventors: Bryan J. Scheele, Neal T. Eidenschink, John L. Schumann, Trent A. Johnson, Daniel W. Scheele, Cameron T. Hempel, Scott J. Cray, Kenneth L. Bolster
-
Publication number: 20160240218Abstract: Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.Type: ApplicationFiled: February 25, 2016Publication date: August 18, 2016Inventors: Scott J. Cray, John L. Schumann, Trent A. Johnson, Luke E. Rose
-
Patent number: 9296188Abstract: Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.Type: GrantFiled: February 17, 2015Date of Patent: March 29, 2016Assignee: Hutchinson Technology IncorporatedInventors: Scott J. Cray, John L. Schumann, Trent A. Johnson, Luke E. Rose
-
Publication number: 20150194176Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.Type: ApplicationFiled: August 25, 2014Publication date: July 9, 2015Inventors: Bryan J. Scheele, Neal T. Eidenschink, John L. Schumann, Trent A. Johnson, Daniel W. Scheele, Cameron T. Hempel, Scott J. Cray, Kenneth L. Bolster
-
Patent number: 8834660Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.Type: GrantFiled: January 7, 2014Date of Patent: September 16, 2014Assignee: Hutchinson Technology IncorporatedInventors: Bryan J. Scheele, Neal T. Eidenschink, John L. Schumann, Trent A. Johnson, Daniel W. Scheele, Cameron T. Hempel, Scott J. Cray, Kenneth L. Bolster
-
Patent number: 7873824Abstract: Apparatus and methods for remotely configuring a computer BIOS of a testing computer system are provided. In one aspect, a method of testing is provided that includes establishing an interface between a first computer system and a second computer system. The second computer system includes a computer readable storage device that has a BIOS and a first set of BIOS configuration settings. The first set of BIOS configuration settings is adapted to a first device under test. At least one instruction is sent from the first computer system to the second computer system to enable the second computer system to select a second set of BIOS configuration settings adapted to a second device under test having different electronic characteristics than the first device under test. An electrical test is performed on the second device under test using the second computer system and the second set of BIOS configuration settings.Type: GrantFiled: June 1, 2007Date of Patent: January 18, 2011Assignee: Advanced Micro Devices, Inc.Inventors: Trent Johnson, Chandrakant Pandya, Hooi-Min Lim, Richard Alan Hamersley
-
Publication number: 20080301422Abstract: Apparatus and methods for remotely configuring a computer BIOS of a testing computer system are provided. In one aspect, a method of testing is provided that includes establishing an interface between a first computer system and a second computer system. The second computer system includes a computer readable storage device that has a BIOS and a first set of BIOS configuration settings. The first set of BIOS configuration settings is adapted to a first device under test. At least one instruction is sent from the first computer system to the second computer system to enable the second computer system to select a second set of BIOS configuration settings adapted to a second device under test having different electronic characteristics than the first device under test. An electrical test is performed on the second device under test using the second computer system and the second set of BIOS configuration settings.Type: ApplicationFiled: June 1, 2007Publication date: December 4, 2008Inventors: Trent Johnson, Chandrakant Pandya, Hooi-Min Lim, Richard Alan Hamersley
-
Patent number: 7275408Abstract: Apparatus and method for simultaneously adjusting the gram load and radius geometry height of a head suspension by scanning a spring region of the head suspension with a laser beam. The incremental height difference between left and right legs of a spring region of the suspension may also be concurrently corrected. Apparatus and method for measuring the radius geometry height are provided by two or more non-contacting optical probes. A nitrogen atmosphere may be maintained in the region scanned.Type: GrantFiled: April 8, 2003Date of Patent: October 2, 2007Assignee: Hutchinson Technology IncorporatedInventors: Senthil Balasubramaniam, Trent A. Johnson, Derek J. Schanil, Roger W. Schmitz, Stephen P. Toperzer, Hryhory T. Koba, Timothy G. Rice, Paul E. Schwing, Blair M. Erickson, Mohamed Salah H. Khlif