Patents by Inventor Trentice Bolar
Trentice Bolar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250287554Abstract: Embodiments of the present invention relate to helical electromagnetic interference shielding (“HES”) structures. In one general aspect, the HES structure includes a folded state, unfolded state, and pair of rectangular EMI shielding panels. The EMI shielding panels form interconnected EMI shielding planes. Each rectangular EMI shielding panel includes a substrate and conductive layer. The conductive layer is positioned near the substrate and includes a conductive composition. The conductive composition includes graphene sheets dispersed in a polymer matrix as a 3D percolated network. The substrate is rectangular and includes a film and/or fabric. The EMI shielding planes are angularly offset from each other about their center axis and form a helical structure when in the unfolded state. Each EMI shielding plane rotates about the center axis when the HES structure transitions between the folded and unfolded states. Adjacent EMI shielding planes are an angular offset from each other.Type: ApplicationFiled: May 21, 2025Publication date: September 11, 2025Applicant: Vorbeck Materials Corp.Inventors: Dan SCHEFFER, Kate Redmond, Trentice Bolar
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Patent number: 12342515Abstract: The instant disclosure relates to EMI shielding structures. A conductive composition is formed that includes a polymer and graphene present as a 3D-matrix therein. Rectangular EMI shielding panels are formed using the composition. Rectangular EMI shielding panels are affixed orthogonal to each other. The EMI shielding panels are successively overlapped to form a plurality of interconnected EMI shielding planes. The EMI shielding panels are affixed to each other to form a helical EMI shielding structure that folds and unfolds along its center axis. The EMI shielding planes are angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer. The EMI shielding planes rotate about the center axis when the HES structure transitions between the folded and unfolded states.Type: GrantFiled: September 1, 2023Date of Patent: June 24, 2025Inventors: Dan Scheffer, Kate Redmond, Trentice Bolar
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Publication number: 20250181874Abstract: Embodiments of the instant disclosure relate to dual functioning signaling devices. The device has a signaling unit that includes an active-and semi-passive signaling components. The signaling unit is affixed to and/or positioned within a textile or substrate. The active signaling component includes a transceiver, power source, and input device to allow the user to selectively transmit identifying information. The semi-passive signaling component includes a radio frequency radiator that reflects an EM response signal when exposed to interrogating EM radiation. The operating frequencies of the active-and semi-passive signaling components are configured to not interfere or interference with each other. The active-and semi-passive signaling components both include antenna elements that include a conductive composition that includes fully exfoliated graphene sheets dispersed with a polymer matrix. The textile can be in the form of a pouch, patch, sticker, and/or panel.Type: ApplicationFiled: November 1, 2023Publication date: June 5, 2025Applicant: VORBECK MATERIALS CORP.Inventors: SRIRAM MANIVANNAN, JAMES TURNEY, Trentice Bolar
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Publication number: 20240081032Abstract: The instant disclosure relates to EMI shielding structures. A conductive composition is formed that includes a polymer and graphene present as a 3D-matrix therein. Rectangular EMI shielding panels are formed using the composition. Rectangular EMI shielding panels are affixed orthogonal to each other. The EMI shielding panels are successively overlapped to form a plurality of interconnected EMI shielding planes. The EMI shielding panels are affixed to each other to form a helical EMI shielding structure that folds and unfolds along its center axis. The EMI shielding planes are angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer. The EMI shielding planes rotate about the center axis when the HES structure transitions between the folded and unfolded states.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Applicant: VORBECK MATERIALS CORP.Inventors: DAN SCHEFFER, KATE REDMOND, TRENTICE BOLAR
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Patent number: 11882680Abstract: Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.Type: GrantFiled: November 14, 2022Date of Patent: January 23, 2024Assignee: VORBECK MATERIALS CORP.Inventors: Dan Scheffer, Kate Redmond, Trentice Bolar
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Publication number: 20230280440Abstract: Embodiments relate to a communications node that includes an interfacing plate assembly; an antenna assembly; a board mounting assembly; a housing; and an enclosure. The housing includes the antenna assembly and the board mounting assembly. The enclosure is a rigid, open ended, sleeve structure that selectively receives the housing and thereby encloses the antenna assembly and the board mounting assembly therein. An interfacing plate assembly is positioned at a second end. The interfacing plate includes an input device coupled to the control circuit that receives user operational input. The antenna assembly includes an antenna frame that includes the antenna elements and orients the antenna elements in each nodal cardinal direction. The board mounting assembly includes the communication device and the control circuit that are positioned proximate to a plate. The plate is coupled to the first end opposite the interfacing plate and thermally coupled to the control circuit.Type: ApplicationFiled: August 24, 2022Publication date: September 7, 2023Applicant: Vorbeck Materials Corp.Inventors: JOHN LETTOW, SRIRAM MANIVANNAN, Dan Scheffer, James Allen Turney, Christie Burrow, Samarpita Chowdhury, Victor Contreras, TRENTICE BOLAR
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Publication number: 20230180446Abstract: Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.Type: ApplicationFiled: November 14, 2022Publication date: June 8, 2023Applicant: Vorbeck Materials Corp.Inventors: DAN SCHEFFER, KATE REDMOND, TRENTICE BOLAR
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Patent number: 8617160Abstract: An intramedullary nail comprising an outer tubular sheath, a flexible rod and a driver element mobile within the sheath longitudinally with an engagement element formed out of the wall of the tubular sheath. After the nail has been inserted, distal end first, into the intramedullary cavity, the flexible rod is pulled, thereby engendering the driver element to advance the engagement element into the cortical bone, thus keeping the intramedullary nail in position within the intramedullary cavity.Type: GrantFiled: March 8, 2011Date of Patent: December 31, 2013Assignee: Torjo Medical Solutions, Inc.Inventors: Khara Quiney, Karen Chien, Evan Boetticher, Trentice Bolar