Patents by Inventor Trentice Bolar

Trentice Bolar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240081032
    Abstract: The instant disclosure relates to EMI shielding structures. A conductive composition is formed that includes a polymer and graphene present as a 3D-matrix therein. Rectangular EMI shielding panels are formed using the composition. Rectangular EMI shielding panels are affixed orthogonal to each other. The EMI shielding panels are successively overlapped to form a plurality of interconnected EMI shielding planes. The EMI shielding panels are affixed to each other to form a helical EMI shielding structure that folds and unfolds along its center axis. The EMI shielding planes are angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer. The EMI shielding planes rotate about the center axis when the HES structure transitions between the folded and unfolded states.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Applicant: VORBECK MATERIALS CORP.
    Inventors: DAN SCHEFFER, KATE REDMOND, TRENTICE BOLAR
  • Patent number: 11882680
    Abstract: Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: January 23, 2024
    Assignee: VORBECK MATERIALS CORP.
    Inventors: Dan Scheffer, Kate Redmond, Trentice Bolar
  • Publication number: 20230280440
    Abstract: Embodiments relate to a communications node that includes an interfacing plate assembly; an antenna assembly; a board mounting assembly; a housing; and an enclosure. The housing includes the antenna assembly and the board mounting assembly. The enclosure is a rigid, open ended, sleeve structure that selectively receives the housing and thereby encloses the antenna assembly and the board mounting assembly therein. An interfacing plate assembly is positioned at a second end. The interfacing plate includes an input device coupled to the control circuit that receives user operational input. The antenna assembly includes an antenna frame that includes the antenna elements and orients the antenna elements in each nodal cardinal direction. The board mounting assembly includes the communication device and the control circuit that are positioned proximate to a plate. The plate is coupled to the first end opposite the interfacing plate and thermally coupled to the control circuit.
    Type: Application
    Filed: August 24, 2022
    Publication date: September 7, 2023
    Applicant: Vorbeck Materials Corp.
    Inventors: JOHN LETTOW, SRIRAM MANIVANNAN, Dan Scheffer, James Allen Turney, Christie Burrow, Samarpita Chowdhury, Victor Contreras, TRENTICE BOLAR
  • Publication number: 20230180446
    Abstract: Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.
    Type: Application
    Filed: November 14, 2022
    Publication date: June 8, 2023
    Applicant: Vorbeck Materials Corp.
    Inventors: DAN SCHEFFER, KATE REDMOND, TRENTICE BOLAR
  • Patent number: 8617160
    Abstract: An intramedullary nail comprising an outer tubular sheath, a flexible rod and a driver element mobile within the sheath longitudinally with an engagement element formed out of the wall of the tubular sheath. After the nail has been inserted, distal end first, into the intramedullary cavity, the flexible rod is pulled, thereby engendering the driver element to advance the engagement element into the cortical bone, thus keeping the intramedullary nail in position within the intramedullary cavity.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: December 31, 2013
    Assignee: Torjo Medical Solutions, Inc.
    Inventors: Khara Quiney, Karen Chien, Evan Boetticher, Trentice Bolar