Patents by Inventor Trevor Davidson

Trevor Davidson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded hockey puck with electronic signal transmitter core
    Patent number: 12023563
    Abstract: A hockey puck is formed as two mating subcomponents encapsulating an internal signal transmitter. The hockey puck includes holes extending from an external surface of the hockey puck into an internal void formed between the two mating subcomponents. The internal signal transmitter includes protrusions extending into the holes, each including a surface-mounted diode. The surface-mounted diodes include no lens cap, allowing the diodes to be positioned closer to the external surface of the puck than existing pucks. For improved visibility, the diode is positioned less than 5 mm from the external surface of the puck, but greater than 1 mm from the external surface of the puck, in order to prevent the diodes from being externally visible. Preferably, the diodes are positioned between approximately 2 mm and approximately 3 mm from the external surface of the hockey puck.
    Type: Grant
    Filed: May 19, 2023
    Date of Patent: July 2, 2024
    Assignee: SPORTSMEDIA TECHNOLOGY CORPORATION
    Inventors: Isaac Walker-Stern, Trevor Davidson, Matthew Bertram
  • Molded hockey puck with electronic signal transmitter core
    Patent number: 11660515
    Abstract: A hockey puck is formed as two mating subcomponents encapsulating an internal signal transmitter. The hockey puck includes holes extending from an external surface of the hockey puck into an internal void formed between the two mating subcomponents. The internal signal transmitter includes protrusions extending into the holes, each including a surface-mounted diode. The surface-mounted diodes include no lens cap, allowing the diodes to be positioned closer to the external surface of the puck than existing pucks. For improved visibility, the diode is positioned less than 5 mm from the external surface of the puck, but greater than 1 mm from the external surface of the puck, in order to prevent the diodes from being externally visible. Preferably, the diodes are positioned between approximately 2 mm and approximately 3 mm from the external surface of the hockey puck.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 30, 2023
    Assignee: SPORTSMEDIA TECHNOLOGY CORPORATION
    Inventors: Isaac Walker-Stern, Trevor Davidson, Matthew Bertram