Abstract: This invention provides a method of fabricating transduction devices on flexible electronics that allows a complete mechatronic system to be incorporated into one system. The method uses the interconnects and pads in flexible electronics substrates to make coils, windings and electrodes for electromagnetic and electrostatic transduction. By building these systems directly into the substrate it is possible to make a complete sensing and actuating system that can be fitted onto machinery that requires power and control. The end result is a flexible, 3-dimensional structure that contains transduction, power, and control interconnections, and is customized for complex mechatronic structures and applications. This gives designers of electromechanical control systems the ability to produce a complete feedback system with sensors, actuators, connectors and electronics; all made out of one component.

Abstract: One embodiment is for the close agitation of electroplating solution substantially near an electrode in an electroplating cell. The agitation occurs within the Nernst diffusion layer allowing for ion replenishment of the electroplating solution at the working electrode face. The system operates by producing a flat agitation face (180) and a working electrode (350) face that are brought to within 10 microns of one another during the plating process whilst the agitator 380 is being actuated. In one embodiment, the working electrode is rigid such as a semiconductor wafer. In another embodiment, the working electrode is a flexible material (600) such as fabric or flexible electronics. Other embodiments are described and shown.