Abstract: A wearable consumer electronic product includes at least a housing arranged to catty operational components comprising a processor and a band having a pliable band body and a securing means arranged to secure the band body to the housing. In one embodiment, the pliable band body has a size and shape suitable for wrapping around an individual appendage and that includes an opening that leads to a cavity within the band body suitable for accumulating an amount of water and a band sensor embedded within the band body in communication with the cavity.

Abstract: Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered.

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.

Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

Abstract: A connectible component is connected to a housing. A sensor of the housing is utilized to detect an identity element of the at connectible component. The connectible component is identified utilizing the at least one sensor. In some implementations, identification of the connectible component may identify whether or not a connectible component is connected to the housing. In other implementations, identification of the connectible component may identify the type of connectible component that is connected. In such implementations, the housing may house an electronic device and the electronic device may be configured based on the type of connectible component that is connected.

Abstract: A ceramic structure and methods for making the ceramic structure are disclosed. Multiple parts may be molded; the parts may be molded from the same or different ceramic materials. The parts may be formed in the same mold and may be adjacent to and/or attached to one another as a result of molding. The parts may be placed in a sintering furnace and sintered simultaneously. Simultaneously sintering the parts forms a unitary structure from the parts.

Abstract: An electronic device includes one or more light emitters for emitting light toward an object and one or more light detectors for collecting light exiting the object. A reflective coating, surface, or surface finish can be applied adjacent to the area to which light is emitted and/or through which light exits in order to increase the light collected by the light detector. The reflective coating can be oriented so as to reflect light back into the object.

Abstract: A connector providing both an electrical and mechanical connection and an electronic device utilizing the connector. The connector includes a rigid body, a head connected to the rigid body, and a flexible conductor coupled to the body. The rigid body and the flexible conductor define an electrically conductive path to the head. An electronic device includes a housing defining at least one sidewall, an interior component, and a connector passing through at least one sidewall and mechanically contacting the interior component. The connector defines an electrically conductive path from the interior component to an exterior of the housing.

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.