Patents by Inventor Trevor John Hutley

Trevor John Hutley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6087427
    Abstract: The invention relates to a moldable thermoplastic resin composition comprising:(a) 99.95-25% by weight of at least one polyamide-containing compound,(b) 0.05-5% by weight of at least one compound selected from the group consisting of magnesium-, zinc- and aluminium salts, and optionally(c) 0-70% by weight of at least one additive compound, which resin composition has an apparent melt viscosity according to ISO 11443 of less than 100 Pa.s, at a shear rate of 1000 s(-1) and at 0.1% by weight moisture content of the resin composition in the form of granules.This invention furthermore relates to molded articles comprising such a thermoplastic resin composition.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: July 11, 2000
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Philip Leslie Boydell, Trevor John Hutley