Abstract: A method is provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.

Abstract: An apparatus and method for simulation and testing of electronic systems using a single model that has the composite behavioral information of multiple parts. The single model allows the designer to simulate using one model that captures the anticipated extremes (best case behavior to worst case behavior) across a collection of devices from different vendors.

Abstract: A method, apparatus and computer program product implement optimized channel routing in an electronic package design. Electronic package physical design data are received. A physical design including a netlist including a plurality of nets is generated. Finite impulse response (FIR) driver coefficients are determined for each net in the netlist from simulation with generation of impulse responses of the netlist.

Abstract: A method, structures and computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.

Abstract: A high frequency connector utilizes flex strip signal/reference conductor pairs extending in channels formed in a dielectric connector body between terminations at connector ends. The flex strips are formed as signal and reference conductor traces separated by a flexible dielectric wherein the impedance can be influenced by the width of the signal and reference traces and the thickness and selected material of the dielectric separating the adjoining conductor traces. Design of the flex strip assemblies is used to vary the capacitance which enables the connector impedance to match the impedance of the circuits and/or cables connected to the connector and mitigate any discontinuities among the sequence of circuit paths. The close proximity of signal and reference traces within the pair and the separation of signal lines in the connector body reduces cross talk by minimizing mutual inductance between signal lines.