Patents by Inventor Trevor Liu

Trevor Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Delamination resistant packaged die having support and shaped die having protruding lip on support
    Patent number: 8058706
    Abstract: A packaged electronic device includes a thickness shaped IC die including a top portion, top surface, active circuitry, bottom portion and bottom surface. A cross sectional area of the bottom surface is ?5% less than a cross sectional area of the top surface to provide a protruding lip having a bottom lip surface. A package substrate includes a top substrate surface including substrate bonding sites, a bottom substrate surface, and a die support structure on the top substrate surface having a gap region. The bottom lip surface of the IC die is secured to the die support structure and the bottom surface of the IC die extends below the die support structure into the gap region. Coupling connectors couple the bonding features on the IC die to the substrate bonding sites.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: November 15, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Chien-Te Feng, Kazuaki Ano, Frank Yu, Trevor Liu
  • DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE HAVING PROTRUDING LIP ON SUPPORT
    Publication number: 20110057296
    Abstract: A packaged electronic device includes a thickness shaped IC die including a top portion, top surface, active circuitry, bottom portion and bottom surface. A cross sectional area of the bottom surface is ?5% less than a cross sectional area of the top surface to provide a protruding lip having a bottom lip surface. A package substrate includes a top substrate surface including substrate bonding sites, a bottom substrate surface, and a die support structure on the top substrate surface having a gap region. The bottom lip surface of the IC die is secured to the die support structure and the bottom surface of the IC die extends below the die support structure into the gap region. Coupling connectors couple the bonding features on the IC die to the substrate bonding sites.
    Type: Application
    Filed: September 8, 2009
    Publication date: March 10, 2011
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: CHIEN-TE FENG, KAZUAKI ANO, FRANK YU, TREVOR LIU