Abstract: A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

Abstract: A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

Abstract: A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: An optical fiber connector of a networking module faceplate assembly includes a shuttle body, a connection assembly, and a retention clip. The shuttle body including a fiber slot extending across the shuttle body and adapted for an optical fiber to extend therethrough. The connection assembly is adapted to connect the optical fiber of the networking module to an external optical fiber connector. The connection assembly includes a ferrule flange fiber termination, a split sleeve, and a ferrule. The ferrule flange fiber termination positioned within the shuttle body and adapted to splice to an end of the optical fiber. A length of the optical fiber connector can be less than half a length of the external optical fiber connector.

Abstract: An optical fiber connector of a networking module faceplate assembly includes a shuttle body, a connection assembly, and a retention clip. The shuttle body including a fiber slot extending across the shuttle body and adapted for an optical fiber to extend therethrough. The connection assembly is adapted to connect the optical fiber of the networking module to an external optical fiber connector. The connection assembly includes a ferrule flange fiber termination, a split sleeve, and a ferrule. The ferrule flange fiber termination positioned within the shuttle body and adapted to splice to an end of the optical fiber. A length of the optical fiber connector can be less than half a length of the external optical fiber connector.

Abstract: A method of installing an asymmetric heat pipe in a heat sink includes providing an asymmetric heat pipe with additional material on one side; forming a cavity in a base of the heat sink leaving additional base material on the component side of the heat sink; inserting the asymmetric heat pipe in the cavity; and removing the additional material on the asymmetric heat pipe and the additional base material on the heat sink to form a smooth and substantially uniform contact surface on the component side. An apparatus includes a component; a heat sink with a cavity; and a flattened heat pipe inserted into the cavity; wherein the heat sink and the heat pipe have a smooth and substantially uniform surface on the side proximal to the component and the heat pipe has a thickness which is substantially the same size on a component side and an opposite side.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A thermal control system for pluggable optics in an optical platform. The thermal control system includes a heatsink and an actuator. The heatsink is configured to dissipate heat from a pluggable optical module in the optical platform. The heatsink includes a mating surface configured to make thermal contact with a module surface of the pluggable optical module inserted into the optical platform. The actuator is configured to manipulate the mating surface to change a contact area between the mating surface and the module surface such that the contact area between the mating surface and the module surface is larger for a temperature above a predetermined temperature than for a temperature below a predetermined temperature.

Abstract: A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.

Abstract: A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.

Abstract: A module includes a physical form factor with one or more openings in a faceplate for receiving a corresponding sub-slot module; module high-speed connectors configured to mate with high-speed connectors in the corresponding sub-slot module; and one or more micro latches for each of the one or more openings to engage a compliant faceplate insert on the corresponding sub-slot module, wherein a single micro latch is utilized to engage a single sub-slot module to provide built-in physical compliancy with a biasing force sufficient to engage the high-speed connectors with the module high-speed connectors. Each of the one or more micro latches includes a latching pin which engages an integrated channel in the compliant faceplate insert on the corresponding sub-slot module and which engages an end of the integrated channel to apply a force to a spring on the compliant faceplate insert.

Abstract: A module includes a physical form factor with one or more openings in a faceplate for receiving a corresponding sub-slot module; module high-speed connectors configured to mate with high-speed connectors in the corresponding sub-slot module; and one or more micro latches for each of the one or more openings to engage a compliant faceplate insert on the corresponding sub-slot module, wherein a single micro latch is utilized to engage a single sub-slot module to provide built-in physical compliancy with a biasing force sufficient to engage the high-speed connectors with the module high-speed connectors. Each of the one or more micro latches includes a latching pin which engages an integrated channel in the compliant faceplate insert on the corresponding sub-slot module and which engages an end of the integrated channel to apply a force to a spring on the compliant faceplate insert.

Abstract: A fiber tray with an adjustable fiber boot exit angle includes one or more trays each including a base layer and a retention mechanism for one or more optical fibers at various positions about the base layer, wherein the one or more trays provide management of the one or more optical fibers in a fiber optic assembly; a fiber boot at an exit point of a tray of the one or more trays, wherein the fiber boot provides an exit for the one or more optical fibers from the fiber tray; and an adjustment mechanism configured to adjust an exit angle of the one or more optical fibers by changing position of the fiber boot, wherein the exit angle is set based on a type of the fiber optic assembly.

Abstract: A method of installing an asymmetric heat pipe in a heat sink includes providing an asymmetric heat pipe with additional material on one side; forming a cavity in a base of the heat sink leaving additional base material on the component side of the heat sink; inserting the asymmetric heat pipe in the cavity; and removing the additional material on the asymmetric heat pipe and the additional base material on the heat sink to form a smooth and substantially uniform contact surface on the component side. An apparatus includes a component; a heat sink with a cavity; and a flattened heat pipe inserted into the cavity; wherein the heat sink and the heat pipe have a smooth and substantially uniform surface on the side proximal to the component and the heat pipe has a thickness which is substantially the same size on a component side and an opposite side.

Abstract: A fiber tray with an adjustable fiber boot exit angle includes one or more trays each including a base layer and a retention mechanism for one or more optical fibers at various positions about the base layer, wherein the one or more trays provide management of the one or more optical fibers in a fiber optic assembly; a fiber boot at an exit point of a tray of the one or more trays, wherein the fiber boot provides an exit for the one or more optical fibers from the fiber tray; and an adjustment mechanism configured to adjust an exit angle of the one or more optical fibers by changing position of the fiber boot, wherein the exit angle is set based on a type of the fiber optic assembly.

Abstract: A connector replacement method in a network element chassis includes obtaining physical access to a backplane in the network element chassis, while the network element chassis is deployed; powering down backplane connectors for replacement while other backplane connectors remained powered; removing the powered down backplane connectors with a connector removal tool; inserting a new set of backplane connectors in place of the removed, powered down backplane connectors with a connector insertion tool; and powering up the new set of backplane connectors.

Abstract: A latch assembly for a cooling unit of a telecommunications shelf assembly, the latch assembly including: a faceplate; a latch handle movably coupled to the faceplate, wherein, when the latch handle is actuated, the cooling unit is attached to/released from the shelf assembly; and a locking mechanism coupled to the latch handle, wherein, when the locking mechanism is actuated, the cooling unit is locked to/unlocked from the shelf assembly; wherein the locking mechanism includes a fan brake actuator mechanism that is coupled to an electronic fan brake switch associated with one or more fans of the cooling unit. Optionally, the latch handle is pivotably coupled to the faceplate and is actuated by rotation. Optionally, the locking mechanism includes a captive screw that is advanced into/backed out of a threaded aperture associated with the faceplate. Optionally, the fan brake actuator mechanism includes a lever member that couples the locking mechanism to the electronic fan brake switch.

Abstract: A cooling fan assembly for use in a telecommunications system, the cooling fan assembly including: a cooling fan including a plurality of radially disposed mounting flanges that are recessed from one or more of an inlet surface and an exhaust surface of the cooling fan; a chassis disposed adjacent to one or more of the inlet surface and the exhaust surface of the cooling fan, wherein a plurality of spaces are formed between the plurality of mounting flanges and the chassis; a plurality of vibration isolators disposed within the plurality of spaces formed between the plurality of mounting flanges and the chassis; and a plurality of rigid pins coupling the chassis to the plurality of vibration isolators. The plurality of vibration isolators are disposed substantially within a volumetric envelope of the cooling fan and the plurality of mounting flanges.