Patents by Inventor Trevor O. Tollefsbol

Trevor O. Tollefsbol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9190837
    Abstract: An EMP/HEMP protection device for protecting equipment from electromagnetic pulses. The protection device includes a housing defining a cavity therein and separated into two chambers, a dirty chamber for propagation of signals before filtering of electromagnetic interference, and a clean chamber, isolated from the dirty chamber, for propagation of signals after filtering. A rigid-flex printed circuit board (PCB) is disposed in the cavity for facilitating electrical connections between the chambers. Surface mount electrical components for EMP/HEMP protection are coupled with the rigid-flex PCB. Power and/or data signals are transferred from the dirty chamber to the clean chamber though a wave guide below cutoff (WBC). The WBC is formed from opposing electrical ground planes within a center PCB of the rigid-flex PCB. An electrically conductive and weather sealing gasket is disposed in the cavity of the housing for further EMI isolation.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: November 17, 2015
    Assignee: Transtector Systems, Inc.
    Inventors: Trevor O. Tollefsbol, Eric Nguyen
  • Publication number: 20130293997
    Abstract: An EMP/HEMP protection device for protecting equipment from electromagnetic pulses. The protection device includes a housing defining a cavity therein and separated into two chambers, a dirty chamber for propagation of signals before filtering of electromagnetic interference, and a clean chamber, isolated from the dirty chamber, for propagation of signals after filtering. A rigid-flex printed circuit board (PCB) is disposed in the cavity for facilitating electrical connections between the chambers. Surface mount electrical components for EMP/HEMP protection are coupled with the rigid-flex PCB. Power and/or data signals are transferred from the dirty chamber to the clean chamber though a wave guide below cutoff (WBC). The WBC is formed from opposing electrical ground planes within a center PCB of the rigid-flex PCB. An electrically conductive and weather sealing gasket is disposed in the cavity of the housing for further EMI isolation.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 7, 2013
    Applicant: Transtector Systems, Inc.
    Inventors: Trevor O. Tollefsbol, Eric Nguyen