Abstract: Apparatus and method for punching registration holes in exposed films having cooperating image areas, in which the films to be registered and punched are supported on a platform, punch means is mounted on the platform for punching registration holes in each film outside its image area, and electronic means is provided for producing an image, preferably, magnified, of at least one selected part of a film supported on the platform.

Abstract: A cubic boron nitride compact is bonded to a cemented carbide support through an alloy bonding layer which contains 40 to 70 percent by weight silver, gold or a combination thereof and 1 to 10 percent by weight of a high melting metal selected from the group of titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum. Bonding may be achieved by first metallizing a surface of the cubic boron nitride compact with a layer of gold or silver or a gold or silver based alloy and then bonding the metallized layer to the carbide support by means of a braze alloy having a liquidus temperature above 700.degree. C.