Patents by Inventor Trevor P. Humphreys

Trevor P. Humphreys has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109851
    Abstract: The present disclosure provides methods for preparing MCL1 inhibitors or a salt thereof and related key intermediates.
    Type: Application
    Filed: August 1, 2023
    Publication date: April 4, 2024
    Inventors: Katrien Brak, Kae M. Bullock, Greg Cizio, Kathy Dao, Darryl D. Dixon, Joshua R. Dunetz, Luke D. Humphreys, Valerie Huynh, Michael A. Ischay, Trevor C. Johnson, Jeffrey E. Merit, Christopher S. Regens, Eric A. Standley, Dietrich P. Steinhuebel, Justin Y. Su, Tao Wu, Marshall D. Young
  • Patent number: 5212401
    Abstract: A rectifying contact for use at high temperatures including a monocrystalline semiconducting diamond layer on a substrate and a heteroepitaxial metal layer thereon. The metal layer has a lattice match with the diamond and is deposited on the diamond substantially in atomic registry therewith. The metal and diamond form a rectifying contact which has good mechanical adhesion and provides stable rectifying operation at elevated temperatures. The metal layer may be formed by deposition in an ultra-high vacuum. In alternate embodiments, the metal layer may be formed on a monocrystalline semiconducting diamond substrate or on at least one monocrystalline diamond area of a textured polycrystalline layer.
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: May 18, 1993
    Assignees: Kobe Steel USA, Inc., North Carolina State University
    Inventors: Trevor P. Humphreys, Robert J. Nemanich, Kalyankumar Das
  • Patent number: 5155559
    Abstract: A semiconductor device comprising a semiconducting diamond layer, (e.g. single crystal or polycrystalline), a refractory metal silicide layer adjacent the diamond layer for forming a rectifying contact therewith, and an annealed interface region between the diamond layer and the refractory metal silicide layer. The annealed interface region is preferably a non-abrupt interface comprising material selected from the group consisting of silicon carbide, the carbide of the refractory metal and mixtures thereof. The present invention also provides a method for making a rectifying contact on a semiconducting diamond layer comprising the steps of forming a refractory metal silicide on the diamond layer, and annealing the refractory metal silicide and diamond layer. Preferably, the step of annealing comprises the step of heating the diamond layer and refractory metal silicide at temperature of at least about 450.degree. C.
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: October 13, 1992
    Assignees: North Carolina State University, Kobe Steel U.S.A. Inc.
    Inventors: Trevor P. Humphreys, Robert J. Nemanich, Kalyankumar Das, Dale G. Thompson, Jr., Scott R. Sahaida