Patents by Inventor Trey W. Huntoon

Trey W. Huntoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Demetallization of polymer/metal multilayer films by etching
    Patent number: 5716532
    Abstract: A method of improving the breakdown strength of polymer multi-layer (PML) capacitors is provided. The method comprises removing metal, specifically, aluminum, from the cut edge. This is done by either etching back the metal electrode layers in either basic or acidic solution or by anodizing the metal to cover that portion of the metal at the edge with an oxide. Removing the metal from the cut edge increases the breakdown strength of the PML capacitors by a factor of two or more.
    Type: Grant
    Filed: June 11, 1996
    Date of Patent: February 10, 1998
    Assignee: Sigma Labs, Inc.
    Inventors: Angelo Yializis, John G. Keimel, Alvin S. Rhorer, Trey W. Huntoon