Patents by Inventor Trey William Stevens Huntoon

Trey William Stevens Huntoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cold cleaving of laser wafers into bars
    Patent number: 5994230
    Abstract: The cleavage of semiconductor crystalline wafers into laser diodes or laser diode bars is carried out at a low temperature at which both the semiconductor crystal substrate and the laser-forming laminate structure thereon are imbrittled. Cleavage at such low temperatures permits the cleavage planes to be closer together than was hitherto possible. A thickness to cavity length ratio of the resulting laser diodes or laser diode bars is approximately 1 as a result compared to 3/4 by prior art techniques. Also, the energy required for cleaving is reduced thus ensuring mirror surfaces at the cleavage planes.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: November 30, 1999
    Assignee: Opto Power Corp
    Inventor: Trey William Stevens Huntoon