Patents by Inventor Tri H. Nguyen

Tri H. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11083093
    Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: August 3, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Charles John Mann, Jiayong Wang, Qiwei Shi, Walter Mark Hendrix, Tri H. Nguyen
  • Publication number: 20200060027
    Abstract: A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.
    Type: Application
    Filed: June 3, 2019
    Publication date: February 20, 2020
    Inventors: Charles John Mann, Jiayong Wang, Qiwei Shi, Walter Mark Hendrix, Tri H. Nguyen
  • Publication number: 20170295665
    Abstract: An overvoltage protection (OVP) module includes: an OVP assembly comprising a plurality of OVP units; a frame mounted to the OVP assembly; a terminal block with a plurality of first electrical ports and a plurality of second electrical ports, the terminal block mounted to the frame; and a plurality of electrical conductors, each conductor electrically connected between one of the first electrical ports of the terminal block and a respective OVP unit.
    Type: Application
    Filed: March 6, 2017
    Publication date: October 12, 2017
    Inventors: Charles J. Mann, Jer-Haw Joseph Yeh, Stephen P. Watson, Tri H. Nguyen
  • Patent number: 7946433
    Abstract: Embodiments of interlocking uprights members for a telecommunications equipment cabinet are presented herein. The uprights include first and second areas that engage in an interlocking and alternating overlap so that the uprights interlock in a plurality of positions to vary a dimension of the cabinet.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: May 24, 2011
    Assignee: Telect Inc.
    Inventor: Tri H. Nguyen
  • Patent number: 7683270
    Abstract: Embodiments of a storage cabinet and methods for making and using such cabinet are disclosed. In one embodiment of an apparatus. a tubular sealed chamber for storing telecommunications equipment is coupled to a sealed chamber to support the sealed chamber. The tubular sealed chamber comprises at least one mount configured to attach and remove the telecommunications equipment, a tube and at least one door to enclose one end of the tube. The support structure partially surrounds the sealed chamber and an area between the sealed chamber and the support structure defines an inter-tube space that functions as a thermal barrier.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: March 23, 2010
    Assignee: Telect Inc.
    Inventors: Pedro Fernandez, Tri H. Nguyen
  • Patent number: 7614509
    Abstract: Embodiments of interlocking uprights members for a telecommunications equipment cabinet are presented herein. In some embodiments, the cabinet is configured to hold a plurality of telecommunications components and has at least one variable dimension. The cabinet may be formed by adjustably joining a pair of identical sub-assemblies in one of a plurality of positions. Additionally, each sub-assembly may include a plurality of upright members, with each of the plurality of upright members having an edge that is configured to interlock, substantially along a length of the upright member, with an edge of a corresponding upright member of the other sub-assembly.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: November 10, 2009
    Assignee: Telect Inc.
    Inventor: Tri H. Nguyen
  • Patent number: 7259326
    Abstract: Embodiments of variable structural members for a telecommunications equipment cabinet are presented herein. The variable structural members include an embedding surface configured to removably receive a structural insert to modify the characteristics of the equipment cabinet. A variety of removable structural inserts may be embedded in the embedding surface. The structural inserts may be arranged and rearranged to modify the structural characteristics of a cabinet such as at the time of manufacture and/or by a technician or user “in the field”.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: August 21, 2007
    Assignee: Telect Inc.
    Inventor: Tri H. Nguyen
  • Patent number: 4694399
    Abstract: In a tomodensitometric image reconstruction process the detectors 11 of the tomodensitometer are offset by .DELTA.d/4 (.DELTA.d being the pitch of the detectors), and reconstruction is performed during one complete revolution of the detector assembly, the linear absorption values being weighed by a coefficient .alpha. and an equivalent number of intermediary values being produced by summing each time two successive juxtaposed real values (summation device 20) and weighing the resulting sum by a coefficient .beta./2 prior reconstructing the image on the basis of all these data.
    Type: Grant
    Filed: March 14, 1985
    Date of Patent: September 15, 1987
    Assignee: Thomson-CGR
    Inventors: Siv C. Tan, Tri H. Nguyen, Claude D. Benchimol