Abstract: In a preferred embodiment, there is provided a method for preparing a printed electronic device, the method comprising debossing a recessed relief or relief pattern into a plane of a substrate, and applying an electrically functional ink generally along the plane, thereby depositing the ink on the substrate substantially without depositing the ink on the recessed relief or relief pattern.

Abstract: In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.

Abstract: In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.

Abstract: In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.

Abstract: This invention relates to elastomeric coatings for electronics. Disclosed is a electronic device comprising a substrate layer, a conductive layer and an encapsulant layer. The encapsulant layer comprises at least a butyl rubber material. The butyl rubber encapsulant prevents a change in resistivity of the conductive layer following exposure to nitric acid vapour for 12 hours or hydrochloric acid vapour for 10 hours.

Abstract: In a preferred embodiment, there is provided a method for preparing a capacitive pressure sensor, the sensor comprising a pair of conductive plate layers and a dielectric layer disposed therebetween, the dielectric layer comprising a dielectric polymer formed with a polymerization mixture fluid, wherein the method comprises placing the polymerization mixture fluid over a mold surface having a first three dimensional pattern thereon to form the dielectric polymer, thereby forming a second three dimensional pattern on a surface of the dielectric polymer complementary to the first three dimensional pattern.

Abstract: This invention relates to elastomeric coatings for electronics. Disclosed is a electronic device comprising a substrate layer, a conductive layer and an encapsulant layer. The encapsulant layer comprises at least a butyl rubber material. The butyl rubber encapsulant prevents a change in resistivity of the conductive layer following exposure to nitric acid vapour for 12 hours or hydrochloric acid vapour for 10 hours.

Abstract: The present invention provides an optically transparent peroxide cured article made from a peroxide curable butyl rubber ionomer comprising repeating units derived from the reaction product of one or more multiolefin monomers and at least one nitrogen or phosphorous based nucleophile comprising a pendant vinyl group. A process is also disclosed for making the optically transparent article.

Abstract: Surface modification methods based on a combination of plasma and chemical treatments render an unfilled butyl rubber surface highly reactive toward organosilanes, allowing formation of an organosilane self-assembled monolayer (SAM). Plasma oxidation of the butyl rubber surface followed by vapor deposition of SiCl4 produces a hydrophilic surface suitable for anchoring organosilanes. Fabrication of SAMs on this hydrophilic butyl rubber surface with n-octadecyltrichlorosilane (OTS) and trichloro(1H,1H,2H,2H-perfluorooctyl)silane (FOTS) via vapor deposition resulted in a 15% and 25% decrease in gas permeability, respectively, with no change in optical transparency of the butyl rubber.

Abstract: Surface modification methods based on a combination of plasma and chemical treatments render an unfilled butyl rubber surface highly reactive toward organosilanes, allowing formation of an organosilane self-assembled monolayer (SAM). Plasma oxidation of the butyl rubber surface followed by vapour deposition of SiCl4 produces a hydrophilic surface suitable for anchoring organosilanes. Fabrication of SAMs on this hydrophilic butyl rubber surface with n-octadecyltrichlorosilane (OTS) and trichloro(1H,1H,2H,2H-perfluorooctyl)silane (FOTS) via vapour deposition resulted in a 15% and 25% decrease in gas permeability, respectively, with no change in optical transparency of the butyl rubber.

Abstract: This invention relates to elastomeric coatings for electronics. Disclosed is a electronic device comprising a substrate layer, a conductive layer and an encapsulant layer. The encapsulant layer comprises at least a butyl rubber material. The butyl rubber encapsulant prevents a change in resistivity of the conductive layer following exposure to nitric acid vapour for 12 hours or hydrochloric acid vapour for 10 hours.

Abstract: A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent, wherein the ligating chemical agent has the chemical structure: wherein n and m are each between about 1 and about 100.

Abstract: A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent, wherein the ligating chemical agent has the chemical structure:

Abstract: A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent, wherein the ligating chemical agent has the chemical structure: wherein n and m are each between about 1 and about 100.

Abstract: A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; applying the ligating copolymer to a substrate surface to cause the ligating copolymer to bind thereto, and contacting the modified substrate surface with a solution of a catalyst, causing the catalyst to be ligated by the ligating copolymer and thus immobilized on the substrate surface. The ligating copolymer may be patterned on the substrate surface using a method such as microcontact printing.

Abstract: A Phase Change Memory (PCM) cell structure comprises both a lower electrode composed of a PCM layer and a conductive encapsulating upper electrode layer. The PCM layer is protected from damage by the conductive encapsulating layer. Electrical isolation between adjacent PCM cells is provided by high electrical resistance regions which were formed by modifying the conductivity of both the PCM layer and the conductive encapsulating upper electrode layer subsequent to deposition thereof.

Abstract: A Phase Change Memory (PCM) cell structure comprises both a lower electrode composed of a PCM layer and a conductive encapsulating upper electrode layer. The PCM layer is protected from damage by the conductive encapsulating layer. Electrical isolation between adjacent PCM cells is provided by high electrical resistance regions which were formed by modifying the conductivity of both the PCM layer and the conductive encapsulating upper electrode layer subsequent to deposition thereof.

Abstract: A method for forming a Phase Change Material (PCM) cell structure comprises forming both a lower electrode composed of a PCM layer and a conductive encapsulating upper electrode layer. The PCM is protected from damage by a conductive encapsulating layer. Electrical isolation between adjacent cells is provided by modifying the conductivity of both the PCM layer and the conductive encapsulating upper electrode layer subsequent to deposition thereof, thereby forming high electrical resistance regions between the cells.

Abstract: The present invention provides a method of forming a patterned thin film on a surface of a substrate having thereon a patterned underlayer of a self-assembled monolayer. The method comprises depositing a thin film material on the self-assembled monolayer to produce a patterned thin film on the surface of the substrate. The present invention further provides processes for preparing the self-assembled monolayer. The present invention still further provides solution-based deposition processes, such as spin-coating and immersion-coating, to deposit a thin film material on the self-assembled monolayer to produce a patterned thin film on the surface of the substrate.

Abstract: A PCM cell structure comprises a lower electrode composed of a Phase Change Memory (PCM) layer and a conductive encapsulating upper electrode layer. The PCM is protected from damage by a conductive encapsulating layer. Electrical isolation between adjacent cells is provided by modifying the conductivity of the PCM layer and the conductive encapsulating upper electrode layer subsequent to deposition.