Patents by Inventor Trilochan Sahoo

Trilochan Sahoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAYOUT TECHNIQUE FOR MIDDLE-END-OF-LINE
    Publication number: 20190385948
    Abstract: In certain aspects of the disclosure, a die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first contact formed over a second portion of the one or more fins, wherein the first contact includes an extended portion that does not overlap the one or more fins. The die also includes first and second metal lines formed from a first metal layer, wherein the first and second metal lines are spaced apart. The die further includes a first via connecting the first contact to the first metal line, and a second via connecting the first contact to the second metal line, wherein the second via is placed on the extended portion of the first contact.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventors: Tin Tin WEE, Trilochan SAHOO, Sunil SUKUMARAPILLAI, Arun Kumar Kodigenahalli VENKATESWAR
  • Layout technique for middle-end-of-line
    Patent number: 10410965
    Abstract: A die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first source/drain contact formed over a second portion of the one or more fins, wherein the first source/drain contact includes an extended portion that does not overlap the one or more fins. The die also includes first and second metal lines formed from a first metal layer, wherein the first and second metal lines are spaced apart. The die further includes a first via connecting the first source/drain contact to the first metal line, and a second via connecting the first source/drain contact to the second metal line, wherein the second via lies within the extended portion of the first source/drain contact.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: September 10, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Tin Tin Wee, Trilochan Sahoo, Sunil Sukumarapillai, Arun Kumar Kodigenahalli Venkateswar
  • Layout technique for middle-end-of-line
    Patent number: 10325845
    Abstract: In certain aspects of the disclosure, a die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first source/drain contact formed over a second portion of the one or more fins, wherein the first source/drain contact includes an extended portion that does not overlap the one or more fins. The die also includes first and second metal lines formed from a first metal layer, wherein the first and second metal lines are spaced apart. The die further includes a first via connecting the first source/drain contact to the first metal line, and a second via connecting the first source/drain contact to the second metal line, wherein the second via lies within the extended portion of the first source/drain contact.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: June 18, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Tin Tin Wee, Trilochan Sahoo, Sunil Sukumarapillai, Arun Kumar Kodigenahalli Venkateswar
  • LAYOUT TECHNIQUE FOR MIDDLE-END-OF-LINE
    Publication number: 20190067189
    Abstract: In certain aspects of the disclosure, a die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first source/drain contact formed over a second portion of the one or more fins, wherein the first source/drain contact includes an extended portion that does not overlap the one or more fins. The die also includes first and second metal lines formed from a first metal layer, wherein the first and second metal lines are spaced apart. The die further includes a first via connecting the first source/drain contact to the first metal line, and a second via connecting the first source/drain contact to the second metal line, wherein the second via lies within the extended portion of the first source/drain contact.
    Type: Application
    Filed: October 12, 2018
    Publication date: February 28, 2019
    Inventors: Tin Tin WEE, Trilochan SAHOO, Sunil SUKUMARAPILLAI, Arun Kumar Kodigenahalli VENKATESWAR
  • LAYOUT TECHNIQUE FOR MIDDLE-END-OF-LINE
    Publication number: 20180374792
    Abstract: In certain aspects of the disclosure, a die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first source/drain contact formed over a second portion of the one or more fins, wherein the first source/drain contact includes an extended portion that does not overlap the one or more fins. The die also includes first and second metal lines formed from a first metal layer, wherein the first and second metal lines are spaced apart. The die further includes a first via connecting the first source/drain contact to the first metal line, and a second via connecting the first source/drain contact to the second metal line, wherein the second via lies within the extended portion of the first source/drain contact.
    Type: Application
    Filed: June 21, 2017
    Publication date: December 27, 2018
    Inventors: Tin Tin Wee, Trilochan Sahoo, Sunil Sukumarapillai, Arun Kumar Kodigenahalli Venkateswar
  • GENETIC MARKER FOR ADVERSE BEHAVIORAL CONDITIONS
    Publication number: 20100136546
    Abstract: The present invention concerns genetic marker for adverse behavioral conditions. In particular aspects, the marker is present at chromosome 15q13 and comprises CHRNA7. In certain cases, the marker is a microdeletion or point mutation in CHRNA7.
    Type: Application
    Filed: August 31, 2009
    Publication date: June 3, 2010
    Inventors: Arthur Beaudet, Shay Ben-Shachar, Trilochan Sahoo