Patents by Inventor Troy A. TIRITILLI

Troy A. TIRITILLI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for thermal control of an information handling resource using thermoelectric effect
    Patent number: 11429085
    Abstract: A system may include an air mover configured to drive a flow of air, a heat-generating component in a path of the flow of air, an assembly comprising heat-rejecting media and a thermoelectric cooling apparatus thermally coupled to the heat-rejecting media and arranged such that the heat-rejecting media is in the path of the flow of air between the air mover and the heat-generating component, and a thermal control system communicatively coupled to the thermoelectric cooling apparatus and configured to control an electrical parameter applied to the thermoelectric cooling apparatus in order to create a temperature gradient across the thermoelectric cooling apparatus, such that when the electrical parameter is applied to the thermoelectric cooling apparatus, heat is transferred from the flow of air to the thermoelectric cooling apparatus via the heat-rejecting media.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: August 30, 2022
    Assignee: Dell Products L.P.
    Inventors: Aubreye Reddell, John R. Palmer, Troy A. Tiritilli, Jeremiah Bartlett
  • SYSTEMS AND METHODS FOR THERMAL CONTROL OF AN INFORMATION HANDLING RESOURCE USING THERMOELECTRIC EFFECT
    Publication number: 20210373531
    Abstract: A system may include an air mover configured to drive a flow of air, a heat-generating component in a path of the flow of air, an assembly comprising heat-rejecting media and a thermoelectric cooling apparatus thermally coupled to the heat-rejecting media and arranged such that the heat-rejecting media is in the path of the flow of air between the air mover and the heat-generating component, and a thermal control system communicatively coupled to the thermoelectric cooling apparatus and configured to control an electrical parameter applied to the thermoelectric cooling apparatus in order to create a temperature gradient across the thermoelectric cooling apparatus, such that when the electrical parameter is applied to the thermoelectric cooling apparatus, heat is transferred from the flow of air to the thermoelectric cooling apparatus via the heat-rejecting media.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Applicant: Dell Products L.P.
    Inventors: Aubreye REDDELL, John R. PALMER, Troy A. TIRITILLI, Jeremiah BARTLETT
  • Universal low profile to full height form factor adapter
    Patent number: 10928866
    Abstract: A method comprising may include mechanically coupling a first main body to a second main body mechanically via a first mechanical feature such that distance between the first main body and the second main body is variable in a first direction, mechanically coupling a chassis engagement feature to the first main body via a second mechanical feature such that distance between the chassis engagement feature and the first main body is variable in a second direction perpendicular to the first direction, wherein the chassis engagement feature is configured to mechanically engage with a chassis when the information handling resource is engaged within the chassis, and mechanically coupling a card engagement feature to the first main body via a third mechanical feature such that distance between the card engagement feature and the first main body is variable in a third direction perpendicular to the first direction and the second direction, wherein the card management feature is configured to mechanically engage with
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: February 23, 2021
    Assignee: Dell Products L.P.
    Inventors: Troy A. Tiritilli, John R. Palmer, Phil R. Geiger
  • UNIVERSAL LOW PROFILE TO FULL HEIGHT FORM FACTOR ADAPTER
    Publication number: 20200393878
    Abstract: A method comprising may include mechanically coupling a first main body to a second main body mechanically via a first mechanical feature such that distance between the first main body and the second main body is variable in a first direction, mechanically coupling a chassis engagement feature to the first main body via a second mechanical feature such that distance between the chassis engagement feature and the first main body is variable in a second direction perpendicular to the first direction, wherein the chassis engagement feature is configured to mechanically engage with a chassis when the information handling resource is engaged within the chassis, and mechanically coupling a card engagement feature to the first main body via a third mechanical feature such that distance between the card engagement feature and the first main body is variable in a third direction perpendicular to the first direction and the second direction, wherein the card management feature is configured to mechanically engage with
    Type: Application
    Filed: June 13, 2019
    Publication date: December 17, 2020
    Applicant: Dell Products L.P.
    Inventors: Troy A. TIRITILLI, John R. PALMER, Phil R. GEIGER