Abstract: An electronic device package lead conditioning method and system corrects bowed-in J-leads (36) of an electronic device package (30) by inserting between a bowed-in J-lead (36) and electronic device package (36) a comb-like tooth (42) having a graduating-width edge, the graduating width edge graduating from a minimum width (112) to a maximum width (114). The minimum width permits the graduating width edge (112) to be inserted into a space (110) separating the bowed-in J-lead (36) from electronic device package (30). The maximum width (114) at least equals the width of a desired spacing for the bowed-in J-lead (36) from the electronic device package (30) for correcting for the bowed-in-condition of the bowed-in J-lead (36).

Abstract: A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).

Abstract: A lead conditioning system (10) provides an offset conditioner (12), a planarity conditioner (14) and a tweeze conditioner station (16), a centering station (18), a transport assembly (20), a cabinet (22) having an input station (24) and an output station (26), and a control electronic control apparatus (28). Offset conditioner (12) conditions the offset spacing between leads of a gull-wing semiconductor device by shifting the leads axially in both directions and returning the leads to a center position according to a predetermined specification. Likewise, planarity conditioner station (14) deforms the leads of the semiconductor device so that the leads are essentially upright then repositions the leads by exerting forces downwardly on the tips of the leads so that the tips of the leads of the semiconductor device are essentially shifted to a coplanar position according to a predetermined specification.

Abstract: An improved braking system comprising inlets imbedded flush with an air track surface with the elongated portions thereof parallel to the direction of wafer travel. The inlets are connected to a controlled vacuum source preferably by means of pressure regulating passageways communicating with both ends of each inlet. When vacuum is applied to the inlets, a traveling wafer passing over and substantially covering the elongated inlets is pulled uniformly and evenly down by vacuum action, so that substantially the entire bottom surface of the wafer contacts the track simultaneously. Thus, the wafer comes to rest at a single position within the braking station, irrespective of the original direction of wafer travel.