Patents by Inventor Troy D. Schwinabart

Troy D. Schwinabart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication tool for bonding
    Patent number: 7866364
    Abstract: A fabrication tool presses a first device surface against a second device surface after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: January 11, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Troy D. Schwinabart, William M. Atkinson
  • Placement of absorbing material in a semiconductor device
    Patent number: 7442576
    Abstract: A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: October 28, 2008
    Inventors: Chien-Hua Chen, David M. Crald, Troy D. Schwinabart
  • Placement of absorbing material in a semiconductor device
    Patent number: 7045885
    Abstract: A semiconductor device includes a hermetically sealed housing having a top member and a bottom member. The bottom member includes a recess. A semiconductor die is enclosed within the housing. Absorbing material is positioned in the recess under the semiconductor die. A porous film is positioned between the semiconductor die and the absorbing material.
    Type: Grant
    Filed: December 9, 2004
    Date of Patent: May 16, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, David M. Craid, Troy D. Schwinabart