Patents by Inventor Troy L. Ruud

Troy L. Ruud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pad over interconnect pad structure design
    Patent number: 9189585
    Abstract: A design rule checker that performs a maximum pattern density check in a first intermediary metallization layer that underlies a top metallization layer and a pad opening in an integrated circuit. The maximum pattern density check is performed at least under some circumstances if a modulus of the primary metallization material is less than a modulus of a surrounding dielectric material. The maximum pattern density check verifies that the pattern density within the underlying portion is below a maximum pattern density that depends on the thickness of the access pad. A maximum metal width check may also be performed in this portion.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: November 17, 2015
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC.
    Inventors: Stevan G. Hunter, Bryce A. Rasmussen, Troy L. Ruud
  • PAD OVER INTERCONNECT PAD STRUCTURE DESIGN
    Publication number: 20140310669
    Abstract: A design rule checker that performs a maximum pattern density check in a first intermediary metallization layer that underlies a top metallization layer and a pad opening in an integrated circuit. The maximum pattern density check is performed at least under some circumstances if a modulus of the primary metallization material is less than a modulus of a surrounding dielectric material. The maximum pattern density check verifies that the pattern density within the underlying portion is below a maximum pattern density that depends on the thickness of the access pad. A maximum metal width check may also be performed in this portion.
    Type: Application
    Filed: June 27, 2014
    Publication date: October 16, 2014
    Inventors: Stevan G. Hunter, Bryce A. Rasmussen, Troy L. Ruud
  • PAD OVER INTERCONNECT PAD STRUCTURE DESIGN
    Publication number: 20130154099
    Abstract: A design rule checker that performs a maximum pattern density check in a first intermediary metallization layer that underlies a top metallization layer and a pad opening in an integrated circuit. The maximum pattern density check is performed at least under some circumstances if a modulus of the primary metallization material is less than a modulus of a surrounding dielectric material. The maximum pattern density check verifies that the pattern density within the underlying portion is below a maximum pattern density that depends on the thickness of the access pad. A maximum metal width check may also be performed in this portion.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Stevan G. Hunter, Bryce A. Rasmussen, Troy L. Ruud