Abstract: Systems, methods, and apparatus related to memory devices. In one approach, an artificial intelligence system uses a memory device to provide inference results. Image data from a camera is provided to the memory device. The memory device stores the image data received from the camera. The memory device includes dynamic random access memory (DRAM), and static random access memory (SRAM). The memory device also includes a processor to run a neural network. The neural network uses the image data as input. An output from the neural network provides an inference result. In one example, the memory device has a same form factor as a conventional DRAM device. The memory device includes a multiply-accumulate (MAC) engine that supports computations for the neural network.

Abstract: The present disclosure provides methods for forming semiconductor devices with laser-etched vias and apparatus including the same. In one embodiment, a method of fabricating a semiconductor device includes providing a substrate having a frontside and a backside, and providing a layer above the frontside of the substrate, the layer having a different composition from the substrate. The method further includes controlling a laser power and a laser pulse number to laser etch an opening through the layer and at least a portion of the frontside of the substrate, filling the opening with a conductive material to form a via, removing a portion of the backside of the substrate to expose the via, and electrically coupling a first element to a second element with the via. A semiconductor device fabricated by such a method is also disclosed.

Abstract: The present disclosure provides methods for forming semiconductor devices with laser-etched vias and apparatus including the same. In one embodiment, a method of fabricating a semiconductor device includes providing a substrate having a frontside and a backside, and providing a layer above the frontside of the substrate, the layer having a different composition from the substrate. The method further includes controlling a laser power and a laser pulse number to laser etch an opening through the layer and at least a portion of the frontside of the substrate, filling the opening with a conductive material to form a via, removing a portion of the backside of the substrate to expose the via, and electrically coupling a first element to a second element with the via. A semiconductor device fabricated by such a method is also disclosed.

Abstract: A handset includes a set of executable instructions associated with an application programming interface (API) as well as a REMO client. Responsive to an indication of a particular application to be executed, the REMO client establishes a communication session over a network connection with a REMO server, on which the requested application is stored. The REMO server remotely invokes a series of API instructions on the handset via the REMO client. Accordingly, the REMO application resides on the REMO server, but can be executed (by way of the REMO client) on the handset without the need for verifying, signing, and downloading a separate application.