Abstract: Techniques for using more-specific routing to perform scalable Layer-2 (L2) stretching of subnets across hybrid-cloud environments. Routing tables in a public cloud may allow for routes that are more specific than the default local route, and the more-specific routes may be used to send all traffic to a dedicated, cloud router. The more-specific routes are set up for a VPC where a subnet resides such that the more specific-routes cover at least a portion of subnet range. The next hop for the more-specific routes point to the cloud router which is capable of doing host routing and segmentation extension. Thus, traffic originating from endpoints in a VPC is routed to the cloud router, and the cloud router determines whether the traffic is to be re-routed back to a destination endpoint in the VPC (or another cloud location), or sent to a destination endpoint residing in the on-premises site.

Abstract: Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.

Abstract: Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.