Patents by Inventor Truoc T. H. Tran

Truoc T. H. Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with die bond flag for ceramic packages
    Patent number: 4829362
    Abstract: A lead frame having a central die bond flag for ceramic integrated circuit die packages. The direct connection of the die bond flag to the lead frame via one or more leads permits direct connection of the back side or substrate of an integrated circuit die to a lead while eliminating dedicated supports that provide physical support but no electrical lead function. In a particular embodiment of the invention, a lead frame is provided whereby any of the leads may be chosen to serve as the die bond flag support/lead combination, whereby the rest of the leads are severed from connection with the die bond flag.
    Type: Grant
    Filed: October 5, 1987
    Date of Patent: May 9, 1989
    Assignee: Motorola, Inc.
    Inventors: Truoc T. H. Tran, James W. Sloan