Abstract: Electronic processing components which may be employed in an aircraft or space craft may be packaged in extreme density module. The module may include a high density interconnect module which provides for the interconnection and routing of data and other signals from processing. On the exterior of the HDI module may be a number of conductive contacts which may be used to receive and transmit signals from the HDI module. An interposer device may be provided which also includes conductive contacts which may be aligned with the conductive contacts on the HDI modules. Data and other signals may be routed through the interposer to a motherboard which also includes external contacts which are laid out in a pattern to match those on the interposer. The components described above may be placed between a base and frame bracket and a compressive force applied in order to establish and maintain the electrical contacts.