Abstract: A hollow pot includes a pot unit and a connection unit. The connection unit is a hollow unit and installed to inner surface of a mold set before pressurized air is introduced in the mold set and before the mold set is closed. A probe is inserted into the mold set and blows the plastic material in the mold set. The plastic material expands and contacts against the inner surface of the mold set and seals the connection holes of the connection unit. The plastic material is extended and broken to match upon the connection holes of the connection unit. The plastic material is solidified to form the pot unit. The pot unit is air-tightly connected to the connection unit, and the conjunction area of the connection unit communicates with the space in the pot unit.

Abstract: A method performed by an electronic camera in flash mode is as follows. A scene ambient lighting indication is obtained. An integration time interval and a flash pulse-on time interval for taking a picture is then set. The set integration time interval is shorter when the indication is bright than when the indication is dark; and the set flash pulse-on time interval is longer when the indication is bright than when the indication is dark. An image is captured using the set integration time interval and the set flash pulse-on time interval in accordance with an electronic rolling shutter (ERS). Other embodiments are also described and claimed.

Abstract: A handle module mounted in a case of an electronic device and including a handle-link assembly and a slide mechanism. The handle-link assembly includes a handle body having a gripping section and a first pivot connection portion formed thereon, and a slide link having a link body unit and a second pivot connection portion formed thereon. The second pivot connection portion is pivotable with the first pivot connection portion. The slide mechanism includes a slide groove unit disposed in the link body unit or the case, and a slide axle unit disposed slidably in the link body unit or the case, and that is slidably extended into the slide groove unit. The handle-link assembly may be moved between a folded state, where the slide link is received in the case, and an unfolded state, where the slide link is extended out of the case.

Abstract: In order to overcome the limitation of the prior art quantum key terminal equipment not being able to operate across different segments, the present invention discloses a quantum cryptography service network implementation technique to let a point-to-point quantum key equipment in one segment be redesigned to cooperate with other quantum key equipment in other segments to form a quantum key service network. As opposed to the prior art technique of having each segment generates its own quantum key, the present invention can map one pair of quantum key equipment with another pair of quantum key equipment, or map multiple pairs of quantum key equipment connected in series to have quantum keys entirely or partly shared by the quantum key equipment. Therefore, the generated quantum keys can be used across different segments. Each node in the quantum key service network can provide the quantum key to nearby telecommunication equipment in the telecommunication network of the same premises.

Abstract: A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal transmission line is formed on a first plane of the substrate, and coupled to a first signal end and a second signal end. A first signal transmitted on the first signal transmission line in a combination method of a microstrip line to co-planar waveguide transition and a co-planar waveguide to microstrip line transition. The second signal transmission line is formed on the second plane of the substrate, and coupled to a third signal end and a fourth signal end. A second signal is transmitted on the second signal transmission line in the co-planar waveguide transmission.

Abstract: A method for recognizing three-dimensional control points and a computer readable medium using the same are disclosed. The method for recognizing three-dimensional control points comprises the following steps. A depth information item corresponding to an image captured by an image capturing apparatus is received. A three-dimensional block information item corresponding to a three-dimensional block is generated according to the depth information. At least one reference plane is generated according to the depth information. At least one connection group is generated according to the three-dimensional block information and the reference plane. A three-dimensional block nearest to the image capturing apparatus is selected as a control point from the connection group.

Abstract: System and method for data mining and feature tracking for fab-wide prediction and control are described. One embodiment is a system comprising a database for storing raw wafer manufacturing data; a data mining module for processing the raw wafer manufacturing data to select the best data therefrom in accordance with at least one of a plurality of knowledge-, statistic-, and effect-based processes; and a feature tracking module associated with the data mining module and comprising a self-learning model wherein a sensitivity of the self-learning model is dynamically tuned to meet real-time production circumstances, the feature tracking module receiving the selected data from the data mining module and generating prediction and control data therefrom; wherein the prediction and control data are used to control future processes in the wafer fabrication facility.

Abstract: A display device includes a thin film transistor substrate, a display layer, a patterned color resist layer, a patterned UV block layer and a transparent protective layer. The thin film transistor substrate has a substrate and a plurality of thin film transistors. The display layer is disposed on the thin film transistor substrate. The patterned color resist layer is disposed on the display layer. The patterned UV block layer is disposed on the patterned color resist layer. The transparent protective layer is disposed on the patterned UV block layer. The present invention also provides a laser transfer printing method for fabricating the color resist layer and the patterned UV block layer.

Abstract: A forming method of a toilet seat which is integrally formed with an embedded heating wire uses primarily a plastic material or glass fiber reinforced plastic to embed a heating wire in a toilet seat, forming the toilet seat which is integrally formed with the embedded heating wire. The toilet seat which is integrally formed with the embedded heating wire is characterized in that the said toilet seat is embedded with the heating wire which contacts with the toilet seat without leaving a gap, thereby forming the integrally formed toilet seat.

Abstract: A spring-piston airsoft gun includes a cylinder-and-piston assembly disposed in a barrel to force air through a muzzle end to make a shooting action, and a coil spring disposed to exert a biasing action to drive a piston head of the cylinder-and-piston assembly when changed from a compressed state to a released state. Front and rear anchor shanks are disposed for respectively mounting front and rear coil segments of the coil spring. A major shell and a minor ring are sleeved on the rear anchor shank to permit the coil spring to be sleeved thereon. The minor ring is in frictional contact with and angularly moveable relative to the major shell such that, when the coil spring is released to expand to the released state, the rear coil segment is tensed to drag the minor ring to angularly move therewith so as to minimize the frictional force therebetween.

Abstract: The present invention relates to an electronic apparatus having stand-by mode. The electronic apparatus comprises: a first circuit, comprising an interface and transferring data to an external device; a second circuit, comprising a processor and setting a first power supplying mode of the first circuit; and a third circuit, setting a second circuit power supplying mode of the second circuit and setting a second power supply mode of the first circuit when the second circuit is disabled; wherein the processor selects a first circuit power supplying mode from power supplying modes of a plurality of first circuits as the second power supplying mode before the second circuit is disabled.

Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.

Abstract: The structure of a projector contains a light path module, a projection lens module, a source lens module, a reflection mirror module, a reflection panel module, and a light source module. The light path module has a U-shaped body. The source lens module and the light source module are configured along a left side of the light path module. The projection lens module is configured along a right side of the light path module. The projection lens module is for projecting image to a screen. The source lens module is for modulating the light from the light source module. The reflection mirror module is installed at a left corner of the light path module to reflect the incident light from the light source module towards the reflection panel module. The reflection panel module is installed from the outside of a right corner of the light path module.

Abstract: An evaluation device is adapted for providing a transceiver system with performance information thereof. The transceiver system models a channel between a transmitter and a receiver thereof using Nakagami distribution with a fading parameter. The evaluation device includes a threshold value computing module, a signal-to-noise ratio (SNR) setting module, a probability computing module, and an output module. The threshold value computing module is operable to compute a threshold value based upon a given capacity. The SNR setting module is operable to set an average SNR for the channel between the transmitter and the receiver of the transceiver system. The probability computing module is operable, based upon the fading parameter, the average SNR and the threshold value, to compute an outage probability of the transceiver system corresponding to the given capacity. The output module is operable to provide the transceiver system with the average SNR and the outage probability.

Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.

Abstract: The present invention provides a color backsheet for a building-integrated photovoltaic (BIPV) module comprising a polyethylene terephthalate (PET) film and a fluorine-containing polymer film, at least one of the films being doped with dyes or pigments. The present invention also provides a color BIPV module comprising the color backsheet according to the present invention.

Abstract: A projection autostereoscopic display including an image projector and a stereo screen is provided. The image projector projects an image. The image includes multiple viewing-zone images. The stereo screen receives the image and reflects the image to an observing direction. The stereo screen includes a linear polarizer layer, for receiving and polarizing the image. A first microretarder layer is disposed behind the linear polarizer layer. A second microretarder layer is disposed behind the first microretarder layer by a distance. A reflection-type polarization-reserved diffuser layer is disposed behind the second microretarder layer for reflecting and diffusing the image into various directions while maintaining the polarization state of the image. A switching layer is switched between a transparent state which maintains the polarization state of the image and an opaque state which changes the polarization states of the image to a non-polarization state, to switch between 2D and 3D display modes.

Abstract: A transfer print structure is provided. The transfer print structure comprises a substrate; a color ink layer including a functional region; and an adhesive device combining the functional region with the substrate.

Abstract: An electronic device includes a touch screen, a user interface module, a detecting module and a process module. The user interface module is configured to create a user interface on the touch screen. A number of hidden active areas are defined in the user interface. A detecting module is configured to detect if the hidden active areas are touched and in what order. A process module is configured to switch the user interface from an operation mode to a test mode after the hidden active areas are touched in a predetermined sequence.

Abstract: A wafer laser-marking method is provided. First, a wafer having a first surface (an active surface) and a second surface (a back surface) opposite to each other is provided. Next, the wafer is thinned. Then, the thinned wafer is fixed on a non-UV tape such that the second surface of the wafer is attached to the tape. Finally, the laser marking step is performed, such that a laser light penetrates the non-UV tape and marks a pattern on the second surface of the wafer. According to the laser-marking method of the embodiment, the pattern is formed by the non-UV residuals left on the second surface of the wafer, and the components of the glue residuals at least include elements of silicon and carbon.