Abstract: A high power LED module includes a substrate formed of a metal bottom thermal transfer plate coated with an insulative layer and having a plurality of electric contacts formed on the metal bottom thermal transfer plate and exposed to the outside of the insulative layer and a plurality of bonding holes cut through the top and bottom sides, epitaxial chips installed in a center area of the substrate and electrically connected to the electric contacts, and a frame injection-molded on the substrate around the at least one epitaxial chip and having a plurality of bonding legs bonded to the bottom bonding holes of the substrate.