Abstract: Provided is a non-volatile semiconductor memory device, including: column lines and row lines; a column decoder for generating a column strobe signal to activate a column line according to a column address signal; a row decoder for generating a row strobe signal to activate a row line according to a row address signal; and a memory array including non-volatile memory cells at junctions of the column lines and row lines respectively. The non-volatile memory cells are each coupled to one of the column lines via a column-enabling switch and to one of the row lines via at least one row-enabling switch. The column-enabling switch and row-enabling switch allow the activated column line and activated row line to enable the non-volatile memory cells according to the row strobe signal and column strobe signal respectively so that the enabled non-volatile memory cells operate in a programming, erasing or reading mode.

Abstract: Provided is a measurement system including: a first chip including at least one first PN junction element adapted to sense a temperature of the first chip; and a second chip electrically connected to the first chip to form a first loop including the first PN junction element. The second chip includes a second loop. The second loop includes at least one second PN junction element adapted to sense a temperature of the second chip. The second chip provides multiple currents in the first loop and the second loop to generate voltage signals associated with the temperature of the first chip and the temperature of the second chip according to the first PN junction element and the second PN junction element and thus calculate the temperature difference between the first chip and the second chip. A measurement method applicable to the measurement system is further provided.

Abstract: A temperature measurement system and method are provided. The temperature measurement system includes: at least one first PN junction element disposed at a first chip to sense a temperature of the first chip; at least one second PN junction element disposed at a second chip to sense a temperature of the second chip; a second temperature measurement circuit electrically connected to the first and second PN junction elements and disposed at the second chip for measuring to obtain a temperature difference value between the first chip and the second chip; a third temperature measurement circuit comprising at least one third PN junction element and disposed at the second chip for measuring to obtain a temperature value of the second chip; and a processing unit for calculating the temperature difference value and the temperature value of the second chip to obtain a temperature value of the first chip.

Abstract: An automotive electronic device durable in an automotive environment of at least 95° C. includes a bottom cover, a circuit board and a heatsink casing. The circuit board is installed on the bottom cover. The heatsink casing is assembled with the bottom cover, and covers the circuit board between the heatsink casing and the bottom cover. The heatsink casing includes an outer surface, a plurality of long fins and a plurality of side fins. The long fins are arranged on the outer surface along a first direction. Two adjacent ones of the long fins have a distance at least greater than 8 mm. The side fins are arranged on an edge of the outer surface along a second direction, and connected to one of the long fins.

Abstract: The present invention discloses a magnetic component and which includes a bobbin, a magnetic core assembly, a first winding, and a second winding. The bobbin has a main body, a channel, and a pin holder. The main body has a primary winding section and a secondary winding section. The channel penetrates the main body. The pin holder is extended from a side of the main body. The magnetic core assembly is partially disposed in the channel of the bobbin. The first winding and the second winding respectively have two outlet terminals. The first winding is wound around the primary winding section. The second winding is wound around the secondary winding section. Two outlet terminals of the first winding and two outlet terminals of the second winding are configured in the pin holder.

Abstract: The present invention discloses a magnetic component and which includes a bobbin, a magnetic core assembly, a first winding, and a second winding. The bobbin has a main body, a channel, and a pin holder. The main body has a primary winding section and a secondary winding section. The channel penetrates the main body. The pin holder is extended from a side of the main body. The magnetic core assembly is partially disposed in the channel of the bobbin. The first winding and the second winding respectively have two outlet terminals. The first winding is wound around the primary winding section. The second winding is wound around the secondary winding section. Two outlet terminals of the first winding and two outlet terminals of the second winding are configured in the pin holder.

Abstract: The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.

Abstract: A portable electronic device including a main body having one end concavely provided with a receiving groove, a pivot pin provided in the receiving groove, a pivot seat pivotally connected to the pivot pin, a transmission line having one end electrically connected to a circuit board provided in the main body and the other end extending into the receiving groove, and a plug having one end embedded in the pivot seat. Since the pivot pin has a hollow configuration, the other end of the transmission line is able to pass through the pivot pin and be electrically connected to the plug, allowing the plug to be rotated and received in the receiving groove when the portable electronic device is not in use and preventing the transmission line from being pulled or curled due to rotation of the plug.

Abstract: A solar photovoltaic panel test platform includes a test section and a signal processing section. The test section has a frame, a light-emitting unit disposed on the frame, a first angle adjustment unit and a second angle adjustment unit arranged on the frame, an air-cooling unit mounted on the first angle adjustment unit for connecting with a first solar photovoltaic panel, and a water-cooling unit mounted on the second angle adjustment unit for connecting with a second solar photovoltaic panel. The signal processing section is connected to the first and second angle adjustment units, the light-emitting unit, the air-cooling unit, the water-cooling unit, and the first and second solar photovoltaic panels. The signal processing section serves to receive sensing signals and transmit control signals. The solar photovoltaic panel test platform can provide different illuminations, angles of incidence and heat dissipation modes to test the efficiency of the solar photovoltaic panels.

Abstract: The present invention is to provide a portable electronic device, which includes a main body having one end concavely provided with a receiving groove, a pivot pin provided in the receiving groove, a pivot seat pivotally connected to the pivot pin, a transmission line having one end electrically connected to a circuit board provided in the main body and the other end extending into the receiving groove, and a plug having one end embedded in the pivot seat. Since the pivot pin has a hollow configuration, the other end of the transmission line is able to pass through the pivot pin and electrically connected to the plug, allowing the plug to be rotated and received in the receiving groove when the portable electronic device is not in use and ensuring the two ends of the transmission line not to be pulled or curled due to rotation of the plug.

Abstract: A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.

Abstract: A heat dissipating apparatus and a method for improving the same are provided. The heat dissipating apparatus includes a heat pipe including a heat-insulating section, a heat-absorbing part, and a heat-dissipating part. The heat-absorbing part is connected with one end of the heat-insulating section. The heat-absorbing part for contacting a heat source is thinner than the heat-insulating section. The heat-dissipating part is connected with the other end of the heat-insulating section.

Abstract: A solar photovoltaic panel test platform includes a test section and a signal processing section. The test section has a frame, a light-emitting unit disposed on the frame, a first angle adjustment unit and a second angle adjustment unit arranged on the frame, an air-cooling unit mounted on the first angle adjustment unit for connecting with a first solar photovoltaic panel, and a water-cooling unit mounted on the second angle adjustment unit for connecting with a second solar photovoltaic panel. The signal processing section is connected to the first and second angle adjustment units, the light-emitting unit, the air-cooling unit, the water-cooling unit, and the first and second solar photovoltaic panels. The signal processing section serves to receive sensing signals and transmit control signals. The solar photovoltaic panel test platform can provide different illuminations, angles of incidence and heat dissipation modes to test the efficiency of the solar photovoltaic panels.

Abstract: This invention discloses a vapor chamber and a method for manufacturing the same. The vapor chamber is used in an electronic device. The electronic device includes a metal casing. The vapor chamber includes an upper cover, a working fluid, a waterproof layer, and a wick structure layer. The upper cover is disposed on inner walls of the metal casing to define a containing space. The working fluid is filled into the containing space. The waterproof layer is formed on inner walls of the containing space. The wick structure layer is formed on the waterproof layer.

Abstract: This invention discloses a vapor chamber and a manufacturing method thereof. The vapor chamber includes a casing, a working fluid, a waterproof layer, and a wick structure layer. The working fluid is filled into the casing. The waterproof layer is formed on inner walls of the casing. The wick structure layer is formed on the waterproof layer.

Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

Abstract: A motherboard integrated with a fan includes a circuit board, a stator, and a blade assembly. The circuit board has at least one hole. The stator is disposed at the circuit board. The blade assembly is rotatably mounted to the stator. When the stator drives the blade assembly to rotate, airflow is formed and passes through the hole.

Abstract: A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.

Abstract: A vapor chamber includes a chamber, a working fluid, a lower wick structure, and a plurality of supporting elements. The chamber includes an upper cover and a bottom plate and contains the working fluid. The lower wick structure is located at the bottom plate. The supporting elements are disposed in the chamber and connect the upper cover and the bottom plate to support the upper cover. Each of the supporting elements and the upper cover form a first inclined angle. The working fluid in the vapor phase flows from the upper cover back to the bottom plate through the supporting elements after condensed.

Abstract: This invention provides a method for assembling the thermal module. According to the invention, the fin can be combined with a heat pipe and a joint material to form the thermal module. The fin includes a main body having a through hole and an feeding hole communicating with each other. The heat pipe passes through the through hole. The joint material is injected into the feeding hole to fill a clearance between the heat pipe and the inner wall of the through hole. In addition, when the fin is combined with the heat pipe, the feeding hole is above the through hole, the joint material flows downward along the clearance, and the clearance gradually narrows along a flowing direction of the joint material.