Abstract: A memory includes: a dielectric fin formed over a substrate; and a pair of memory cells disposed along respective sidewalls of the dielectric fin, each of the pair of memory cells comprising: a first conductor layer; a selector layer; a resistive material layer; and a second conductor layer, wherein the first conductor layer, selector layer, resistive material layer, and second conductor layer each includes upper and lower boundaries, and at least one of the upper and lower boundaries is tilted away from one of the sidewalls of the dielectric fin by an angle.

Abstract: A memory management method, a memory storage device, and a memory control circuit unit are provided. The method includes: reading first data from a first physical unit by using a first read voltage level according to first management information among multiple candidate management information; decoding the first data and recording first error bit information of the first data; and adjusting sorting information related to the candidate management information according to the first error bit information. The sorting information reflects a usage order of the candidate management information in a decoding operation.

Abstract: A memory management method, a memory storage device, and a memory control circuit unit are provided. The method includes: reading first data from a first physical unit by using a first read voltage level according to first management information among multiple candidate management information; decoding the first data and recording first error bit information of the first data; and adjusting sorting information related to the candidate management information according to the first error bit information. The sorting information reflects a usage order of the candidate management information in a decoding operation.

Abstract: A voltage adjusting method, a memory controlling circuit unit and a memory storage device are provided. The method includes: reading a first physical programming unit in a first physical programming unit group to obtain first data; correcting the first data according to a first error check and correction code corresponding to the first data to obtain first corrected data; reading a second physical programming unit in the first physical programming unit group to obtain second data; and adjusting a first read voltage for reading a first memory cell to a second read voltage according to the first data, the first corrected data, and the second data.

Abstract: A voltage adjusting method, a memory controlling circuit unit and a memory storage device are provided. The method includes: reading a first physical programming unit in a first physical programming unit group to obtain first data; correcting the first data according to a first error check and correction code corresponding to the first data to obtain first corrected data; reading a second physical programming unit in the first physical programming unit group to obtain second data; and adjusting a first read voltage for reading a first memory cell to a second read voltage according to the first data, the first corrected data, and the second data.

Abstract: A NAND flash memory unit is described, including a string of memory cells connected in series, S/D regions coupled to two terminals of the string, at least one select transistor couple between a terminal of the string and an S/D region, and at least one erase transistor couple between the at least one select transistor and an S/D region. The select transistor is for selecting the string of memory cells. The erase transistor is for reducing Vt-shift of the select transistor.

Abstract: A NAND flash memory unit is described, including a string of memory cells connected in series, S/D regions coupled to two terminals of the string, at least one select transistor couple between a terminal of the string and an S/D region, and at least one erase transistor couple between the at least one select transistor and an S/D region. The select transistor is for selecting the string of memory cells. The erase transistor is for reducing Vt-shift of the select transistor.

Abstract: A NAND flash memory unit is described, including a string of memory cells connected in series, S/D regions coupled to two terminals of the string, at least one select transistor couple between a terminal of the string and an S/D region, and at least one erase transistor couple between the at least one select transistor and an S/D region. The select transistor is for selecting the string of memory cells. The erase transistor is for reducing Vt-shift of the select transistor.

Abstract: A NAND flash memory unit is described, including a string of memory cells connected in series, S/D regions coupled to two terminals of the string, at least one select transistor couple between a terminal of the string and an S/D region, and at least one erase transistor couple between the at least one select transistor and an S/D region. The select transistor is for selecting the string of memory cells. The erase transistor is for reducing Vt-shift of the select transistor.