Patents by Inventor Tsai-Ming Lai

Tsai-Ming Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REDISTRIBUTION LAYER STRUCTURE FOR HIGH-DENSITY SEMICONDUCTOR PACKAGE ASSEMBLY
    Publication number: 20250210568
    Abstract: A redistribution layer (RDL) structure for a semiconductor package assembly is provided. The RDL structure includes a via and a first conductive trace connected to the via. The first conductive trace includes a first segment and a second segment. The first segment is disposed away from the via and extends along a first direction. The second segment is disposed close to the via and connected to the first segment. The second segment extends along a second direction. A width of the first conductive trace is stepwise increased toward the via.
    Type: Application
    Filed: March 17, 2023
    Publication date: June 26, 2025
    Inventors: Yi-Jou LIN, Tsai-Ming LAI, I-Hsuan PENG, Wei-Chen CHANG, Laurene YIP
  • LIDDED SEMICONDUCTOR PACKAGE
    Publication number: 20230060065
    Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The two-part lid comprises an annular lid base and a cover plate removably installed on the annular lid base.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 23, 2023
    Applicant: MEDIATEK INC.
    Inventors: Yi-Lin Tsai, Yi-Jou Lin, Tsai-Ming Lai, Wei-Chen Chang