Patents by Inventor Tsai Ming Lee

Tsai Ming Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via connection to a partially filled trench
    Patent number: 11929258
    Abstract: An integrated circuit structure includes a first metal feature formed into a first dielectric layer, a second metal feature formed into a second dielectric layer, the second dielectric layer being disposed on said first dielectric layer, and a via connecting the first metal feature to the second metal feature, wherein a top portion of the via is offset from a bottom portion of the via.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue
  • Elevating device for planer displayer
    Publication number: 20020101139
    Abstract: An elevating device includes a facility, such as a planer displayer slidably received in a housing and movable outward of the housing in an outward working position and inward of the housing in an inward storing position for allowing the displayer to be covered and shielded in the housing and to be prevented from being dirtied. A pneumatic or hydraulic actuator or a motorized elevating device is disposed in the housing for moving the monitor in and out of the housing. One or more posts are disposed in the housing for guiding the object to move up and down along the posts.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventor: Tsai Ming Lee