Patents by Inventor Tsai-Wei Chung

Tsai-Wei Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11389644
    Abstract: A flexible thin film metal oxide electrode fabrication methods and devices are provided and illustrated with thin film polyimide electrode formation and IrOx chemical bath deposition. Growth factors of the deposited film such as film thickness, deposition rate and quality of crystallites can be controlled by varying the solution pH, temperature and component concentrations of the bath. The methods allow for selective deposition of IrOx on a flexible substrate (e.g. polyimide electrode) where the IrOx will only coat onto an exposed metal area but not the entire device surface. This feature enables the bath process to coat the IrOx onto every individual electrode in one batch, and to ensure electrical isolation between channels. The ability to perform selective deposition, pads for external connections will not have IrOx coverage that would otherwise interfere with a soldering/bumping process.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: July 19, 2022
    Assignees: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Wentai Liu, Chih-Wei Chang, Pu-Wei Wu, Chung-Yu Wu, Po-Chun Chen, Tsai-Wei Chung
  • Publication number: 20190329029
    Abstract: A flexible thin film metal oxide electrode fabrication methods and devices are provided and illustrated with thin film polyimide electrode formation and IrOx chemical bath deposition. Growth factors of the deposited film such as film thickness, deposition rate and quality of crystallites can be controlled by varying the solution pH, temperature and component concentrations of the bath. The methods allow for selective deposition of IrOx on a flexible substrate (e.g. polyimide electrode) where the IrOx will only coat onto an exposed metal area but not the entire device surface. This feature enables the bath process to coat the IrOx onto every individual electrode in one batch, and to ensure electrical isolation between channels. The ability to perform selective deposition, pads for external connections will not have IrOx coverage that would otherwise interfere with a soldering/bumping process.
    Type: Application
    Filed: May 6, 2019
    Publication date: October 31, 2019
    Applicants: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Wentai Liu, Chih-Wei Chang, Pu-Wei Wu, Chung-Yu Wu, Po-Chun Chen, Tsai-Wei Chung