Abstract: Ultrasound imaging is a non-invasive, non-radioactive, and low cost technology for diagnosis and identification of implantable medical devices in real time. Developing new ultrasound activated coatings is important to broaden the utility of in vivo marking by ultrasound imaging. Ultrasound responsive macro-phase segregated micro-composite thin films were developed to be coated on medical devices composed of multiple materials and with multiple shapes and varying surface area. The macro-phase segregated films having silica micro-shells in polycyanoacrylate produces strong color Doppler signals with the use of a standard clinical ultrasound transducer. Electron microscopy showed a macro-phase separation during slow curing of the cyanoacrylate adhesive, as air-filled silica micro-shells were driven to the surface of the film. The air sealed in the hollow space of the silica shells acted as an ultrasound contrast agent and echo decorrelation of air exposed to ultrasound waves produces color Doppler signals.

Abstract: Ultrasound imaging is a non-invasive, non-radioactive, and low cost technology for diagnosis and identification of implantable medical devices in real time. Developing new ultrasound activated coatings is important to broaden the utility of in vivo marking by ultrasound imaging. Ultrasound responsive macro-phase segregated micro-composite thin films were developed to be coated on medical devices composed of multiple materials and with multiple shapes and varying surface area. The macro-phase segregated in films having silica micro-shells in polycyanoacrylate produces strong color Doppler signals with the use of a standard clinical ultrasound transducer. Electron microscopy showed a macro-phase separation during slow curing of the cyanoacrylate adhesive, as air-filled silica micro-shells were driven to the surface of the film. The air sealed in the hollow space of the silica shells acted as an ultrasound contrast agent and echo decorrelation of air exposed to ultrasound waves produces color Doppler signals.

Abstract: Apparatus, systems, and methods for conducting an etch removal process on a workpiece are provided. The method can include generating a plasma from a deposition process gas in a plasma chamber using a plasma source to deposit a passivation layer on certain layers of a high aspect ratio structure. The method can include generating a plasma from an etch process gas in a plasma chamber using a plasma source to remove certain layers from the high aspect ratio structure. The method can include removing silicon nitride layers at a faster etch rate than silicon dioxide layers on the high aspect ratio structure.

Abstract: Apparatus, systems, and methods for conducting a silicon containing material removal process on a workpiece are provided. In one example implementation, the method can include generating species from a process gas in a first chamber using an inductive coupling element. The method can include introducing a fluorine containing gas with the species to create a mixture. The mixture can include exposing a silicon structure of the workpiece to the mixture to remove at least a portion of the silicon structure.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The workpiece has at least one material layer and at least one structure thereon. The method includes admitting a process gas into a plasma chamber, generating one or more species from the process gas, and filtering the one or more species to create a filtered mixture. The method further includes providing RF power to a bias electrode to generate a second mixture and exposing the workpiece to the second mixture to etch a least a portion of the material layer and to form a film on at least a portion of the material layer.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The method includes performing a spacer treatment process to expose the workpiece to species generated from a first process gas in a first plasma to perform a spacer treatment process on a spacer layer on the workpiece. The first plasma can be generated in the processing chamber. After performing the spacer treatment process, the method can include performing a spacer etch process to expose the workpiece to neutral radicals generated from a second process gas in a second plasma to etch at least a portion of the spacer layer on the workpiece. The second plasma can be generated in a plasma chamber that is remote from the processing chamber.

Abstract: A speaker device having a resonance chamber with adjustable volume can include a speaker chamber and an acoustic deflecting module. The speaker chamber has a transducer, and the audio signal generated by the speaker chamber can be output via the transducer. The acoustic deflecting module is disposed adjacent to the speaker chamber. An outer surface of the acoustic deflecting module changes a transmission direction of the audio signal. An inner volume of the acoustic deflecting module is the resonance chamber with the adjustable volume. The acoustic deflecting module includes a base, a cover, a plate and a driving mechanism. The cover is assembled with the base. The plate is movably disposed inside the cover to form a resonance chamber. The driving mechanism is disposed on the cover and assembled with the plate, and adapted to move the plate inside the resonance chamber for vary a volume of the resonance chamber.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The workpiece has at least one material layer and at least one structure thereon. The method includes admitting a process gas into a plasma chamber, generating one or more species from the process gas, and filtering the one or more species to create a filtered mixture. The method further includes providing RF power to a bias electrode to generate a second mixture and exposing the workpiece to the second mixture to etch a least a portion of the material layer and to form a film on at least a portion of the material layer.

Abstract: A speaker device having a resonance chamber with adjustable volume can include a speaker chamber and an acoustic deflecting module. The speaker chamber has a transducer, and the audio signal generated by the speaker chamber can be output via the transducer. The acoustic deflecting module is disposed adjacent to the speaker chamber. An outer surface of the acoustic deflecting module changes a transmission direction of the audio signal. An inner volume of the acoustic deflecting module is the resonance chamber with the adjustable volume. The acoustic deflecting module includes a base, a cover, a plate and a driving mechanism. The cover is assembled with the base. The plate is movably disposed inside the cover to form a resonance chamber. The driving mechanism is disposed on the cover and assembled with the plate, and adapted to move the plate inside the resonance chamber for vary a volume of the resonance chamber.

Abstract: Apparatus, systems, and methods for conducting an etch removal process on a workpiece are provided. The method can include generating a plasma from a deposition process gas in a plasma chamber using a plasma source to deposit a passivation layer on certain layers of a high aspect ratio structure. The method can include generating a plasma from an etch process gas in a plasma chamber using a plasma source to remove certain layers from the high aspect ratio structure. The method can include removing silicon nitride layers at a faster etch rate than silicon dioxide layers on the high aspect ratio structure.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The method includes performing a spacer treatment process to expose the workpiece to species generated from a first process gas in a first plasma to perform a spacer treatment process on a spacer layer on the workpiece. The first plasma can be generated in the processing chamber. After performing the spacer treatment process, the method can include performing a spacer etch process to expose the workpiece to neutral radicals generated from a second process gas in a second plasma to etch at least a portion of the spacer layer on the workpiece. The second plasma can be generated in a plasma chamber that is remote from the processing chamber.

Abstract: Apparatus, systems, and methods for conducting a silicon containing material removal process on a workpiece are provided. In one example implementation, the method can include generating species from a process gas in a first chamber using an inductive coupling element. The method can include introducing a fluorine containing gas with the species to create a mixture. The mixture can include exposing a silicon structure of the workpiece to the mixture to remove at least a portion of the silicon structure.

Abstract: Ultrasound imaging is a non-invasive, non-radioactive, and low cost technology for diagnosis and identification of implantable medical devices in real time. Developing new ultrasound activated coatings is important to broaden the utility of in vivo marking by ultrasound imaging. Ultrasound responsive macro-phase segregated micro-composite thin films were developed to be coated on medical devices composed of multiple materials and with multiple shapes and varying surface area. The macro-phase segregated in films having silica micro-shells in polycyanoacrylate produces strong color Doppler signals with the use of a standard clinical ultrasound transducer. Electron microscopy showed a macro-phase separation during slow curing of the cyanoacrylate adhesive, as air-filled silica micro-shells were driven to the surface of the film. The air sealed in the hollow space of the silica shells acted as an ultrasound contrast agent and echo decorrelation of air exposed to ultrasound waves produces color Doppler signals.

Abstract: A cover adapted to an electronic device is provided. An outer side of the electronic device has a connection port. The cover includes a first covering structure and a second covering structure. The first covering structure is disposed on the outer side and has a plurality of first openings. The second covering structure is connected to the first covering structure and has a second opening. The second opening is aligned to the connection port, and the second opening is separated from the first openings. A connector is adapted to be inserted into the connection port through the second opening.

Abstract: A cover adapted to an electronic device is provided. An outer side of the electronic device has a connection port. The cover includes a first covering structure and a second covering structure. The first covering structure is disposed on the outer side and has a plurality of first openings. The second covering structure is connected to the first covering structure and has a second opening. The second opening is aligned to the connection port, and the second opening is separated from the first openings. A connector is adapted to be inserted into the connection port through the second opening.

Abstract: An electronic device includes a first machine body and a second machine body adapted to be detachably assembled to the first machine body. The first machine body includes a first casing, a first hinge fixed to a side of the first casing, a second hinge pivoted to the first hinge along an axis, and a first connecting member disposed at the side and linked to the second hinge. The first and the second hinges are covered by the first casing. The second machine body includes a second casing and a second connecting member. When the first machine body is assembled to the second machine body, the first connecting member is fixed to the second connecting member, the second hinge is fixed jointly so that the first hinge is rotatable related to the second hinge. Accordingly, the first casing is rotatable related to the second casing.

Abstract: An electronic device includes a first machine body and a second machine body adapted to be detachably assembled to the first machine body. The first machine body includes a first casing, a first hinge fixed to a side of the first casing, a second hinge pivoted to the first hinge along an axis, and a first connecting member disposed at the side and linked to the second hinge. The first and the second hinges are covered by the first casing. The second machine body includes a second casing and a second connecting member. When the first machine body is assembled to the second machine body, the first connecting member is fixed to the second connecting member, the second hinge is fixed jointly so that the first hinge is rotatable related to the second hinge. Accordingly, the first casing is rotatable related to the second casing.

Abstract: An elastic cover, adapted to be disposed at a lateral side of an electronic device to cover at least a portion of a transmitting port, includes a body having two shielding sheets. Each shielding sheet includes a first portion close to the other shielding sheet and a second portion away from the other shielding sheet. A turn is formed between the first and the second portions so that a cross-section of the shielding sheet appears as a V shape. An opening of the V shape is adapted to face the lateral side. A slit is formed between the two shielding sheets and adapted to correspond to the transmitting port. A transmitting object is adapted to push the two first portions to enlarge the slit, so as to pass through the body and be plugged into the transmitting port. An electronic apparatus having the elastic cover is further provided.

Abstract: An electronic device includes a first machine body and a second machine body adapted to be detachably assembled to the first machine body. The first machine body includes a first casing, a first hinge fixed to a side of the first casing, a second hinge pivoted to the first hinge along an axis, and a first connecting member disposed at the side and linked to the second hinge. The first and the second hinges are covered by the first casing. The second machine body includes a second casing and a second connecting member. When the first machine body is assembled to the second machine body, the first connecting member is fixed to the second connecting member, the second hinge is fixed jointly so that the first hinge is rotatable related to the second hinge. Accordingly, the first casing is rotatable related to the second casing.

Abstract: An elastic cover, adapted to be disposed at a lateral side of an electronic device to cover at least a portion of a transmitting port, includes a body having two shielding sheets. Each shielding sheet includes a first portion close to the other shielding sheet and a second portion away from the other shielding sheet. A turn is formed between the first and the second portions so that a cross-section of the shielding sheet appears as a V shape. An opening of the V shape is adapted to face the lateral side. A slit is formed between the two shielding sheets and adapted to correspond to the transmitting port. A transmitting object is adapted to push the two first portions to enlarge the slit, so as to pass through the body and be plugged into the transmitting port. An electronic apparatus having the elastic cover is further provided.