Abstract: In a heat dissipating assembly, a base frame is disposed underneath a circuit board and includes a bottom part with opposite first and second sides that are formed with first and second engaging units, respectively. The first and second engaging units extend upwardly through a set of through holes in the circuit board. A heat-dissipating module is mounted on the circuit board and includes a heat transfer plate to establish heat-conductive contact with an electronic component on the circuit board. An anchoring device includes a first anchoring unit that engages the first engaging unit, a second anchoring unit that engages the second engaging unit, and an abutting unit connected to the first and second anchoring units. The anchoring device biases the heat transfer plate toward the electronic component when the first and second anchoring units engage the first and second engaging units.