Patents by Inventor Tsai-Yu Lin

Tsai-Yu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180275780
    Abstract: An electronic assembly including an electronic device and a stylus is provided. The electronic device includes a housing having a receiving groove and an opening, the opening communicating with the receiving groove, and a first connecting element disposed around the opening. The stylus includes a sleeve and a pen rod. The sleeve has a second connecting element and corresponds to the receiving groove. The second connecting element is combined with the first connecting element to fix the sleeve to the housing. The pen rod is slidably disposed in the sleeve and has a first end and a second end opposite to each other, and a third connecting element located at the first end.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 27, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Tsai-Yu Lin, Hsin Yeh, Wei-Hao Lan
  • Patent number: 10037050
    Abstract: An electronic device includes a body, a stand and a sliding member. The stand is rotatably connected to the body. The sliding member is slidably disposed on the body and has at least one stopping portion and at least one pushing portion. When the sliding member is located at a first position, the stopping portion interferes with the stand to stop the stand from expanding from the body. When the sliding member slides relative to the body to be away from the first position, the stopping portion releases the stand and the pushing portion pushes the stand to drive the stand to rotate and expand from the body.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: July 31, 2018
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chia-Chi Lin, Wei-Hao Lan, Tsai-Yu Lin, Jyh-Chyang Tzou, Hsin Yeh, Tzu-Fang Huang
  • Patent number: 9946301
    Abstract: A pivot structure includes a base, a bracket, an elastic component, and a positioning assembly. The bracket is rotatably connected to the base. The elastic component is disposed on the base. The positioning assembly includes an elastic clip and a pillar. The elastic clip is pivoted to the base and has a first releasing segment and a first positioning segment. The pillar is connected to the bracket and has a second positioning segment. The pillar is rotatably clipped in the elastic clip. The bracket is adapted to be expanded to a first expanding state through an elastic force of the elastic component, so as to drive the second positioning segment to move along the first releasing segment. The bracket is adapted to receive an external force to be further expanded to a second expanding state, so as to drive the second positioning segment to move to the first positioning segment.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: April 17, 2018
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Hao Lan, Jyh-Chyang Tzou, Ching-Tai Chang, Chia-Chi Lin, Tsai-Yu Lin, Hsin Yeh, Che-Hsien Lin, Cheng-Shiue Jan
  • Publication number: 20180052487
    Abstract: An electronic device includes a body, a stand and a sliding member. The stand is rotatably connected to the body. The sliding member is slidably disposed on the body and has at least one stopping portion and at least one pushing portion. When the sliding member is located at a first position, the stopping portion interferes with the stand to stop the stand from expanding from the body. When the sliding member slides relative to the body to be away from the first position, the stopping portion releases the stand and the pushing portion pushes the stand to drive the stand to rotate and expand from the body.
    Type: Application
    Filed: July 4, 2017
    Publication date: February 22, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chia-Chi Lin, Wei-Hao Lan, Tsai-Yu Lin, Jyh-Chyang Tzou, Hsin Yeh, Tzu-Fang Huang
  • Patent number: 9898038
    Abstract: An electronic apparatus includes a base and an electronic device. The base includes a first main body and at least one first connection portion. The first connection portion includes a rotating component, and the rotating component is pivoted to the first main body and has a driven portion and a positioning portion. The electronic device includes a second main body and at least one second connection portion. The second connection portion includes an elastic component and a positioning trench. The elastic component is connected to the second main body, and the positioning trench is formed on the second main body. When the base supports the electronic device so that the first connection portion is aligned to the second connection portion, the elastic component pushes the driven portion such that the positioning portion is engaged into the positioning trench.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: February 20, 2018
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Hsin Yeh, Chia-Shin Weng, Wei-Hao Lan, Tsai-Yu Lin, Yuan-Ping Chu
  • Publication number: 20170344067
    Abstract: A pivot structure includes a base, a bracket, an elastic component, and a positioning assembly. The bracket is rotatably connected to the base. The elastic component is disposed on the base. The positioning assembly includes an elastic clip and a pillar. The elastic clip is pivoted to the base and has a first releasing segment and a first positioning segment. The pillar is connected to the bracket and has a second positioning segment. The pillar is rotatably clipped in the elastic clip. The bracket is adapted to be expanded to a first expanding state through an elastic force of the elastic component, so as to drive the second positioning segment to move along the first releasing segment. The bracket is adapted to receive an external force to be further expanded to a second expanding state, so as to drive the second positioning segment to move to the first positioning segment.
    Type: Application
    Filed: April 27, 2017
    Publication date: November 30, 2017
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Hao Lan, Jyh-Chyang Tzou, Ching-Tai Chang, Chia-Chi Lin, Tsai-Yu Lin, Hsin Yeh, Che-Hsien Lin, Cheng-Shiue Jan
  • Publication number: 20170106125
    Abstract: The present disclosure provides a hydrogel composition including: a hydrogel having a structure represented by Formula (I) or Formula (II) shown as follows: A-B-BOX-B-A, Formula (I); B-A-B-(BOX-BAB)n-BOX-B-A-B, Formula (II), wherein, A is a hydrophilic polyethylene glycol polymer, B is a hydrophobic polyester polymer, BOX is a bifunctional group monomer of 2,2?-Bis(2-oxazoline) for coupling di-block of A-B or tri-block of B-A-B, and n is an integer greater than or equal to 0; and an anti-adhesion additive, wherein the anti-adhesion additive comprises a carbohydrate, a nitrogen-containing cyclic compound, a polymer or a combination thereof.
    Type: Application
    Filed: October 14, 2016
    Publication date: April 20, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Chi WANG, Hsin-Hsin SHEN, Chin-Fu CHEN, Meng-Yow HSIEH, Sen-Lu CHEN, Yu-Bing LIOU, Tsai-Yu LIN, Pei-Shan LI, Wei-Lin YU
  • Publication number: 20160282909
    Abstract: An electronic apparatus includes a base and an electronic device. The base includes a first main body and at least one first connection portion. The first connection portion includes a rotating component, and the rotating component is pivoted to the first main body and has a driven portion and a positioning portion. The electronic device includes a second main body and at least one second connection portion. The second connection portion includes an elastic component and a positioning trench. The elastic component is connected to the second main body, and the positioning trench is formed on the second main body. When the base supports the electronic device so that the first connection portion is aligned to the second connection portion, the elastic component pushes the driven portion such that the positioning portion is engaged into the positioning trench.
    Type: Application
    Filed: January 19, 2016
    Publication date: September 29, 2016
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Hsin Yeh, Chia-Shin Weng, Wei-Hao Lan, Tsai-Yu Lin, Yuan-Ping Chu
  • Patent number: 8940333
    Abstract: An amphiphilic block copolymer is disclosed. The amphiphilic block copolymer includes one or more hydrophilic polymers, one or more hydrophobic polymer, and one or more zwitterions. The invention also provides a nanoparticle and carrier including the amphiphilic block copolymer for delivery of water insoluble drugs, growth factors, genes, or water insoluble cosmetic substances.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: January 27, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Fa Hsieh, Hsuen-Tseng Cha'ng, Chin-Fu Chen, Yuan-Chia Chang, Pei Kan, Tsai-Yu Lin
  • Patent number: 8614190
    Abstract: Thermal responsive compositions for treating bone diseases are provided. The thermal responsive composition for treating bone diseases includes a bone growth factor and a biodegradable copolymer. The biodegradable copolymer has a structure of Formula (I) or Formula (II): A-B-BOX-B-A??Formula (I) B-A-B-(BOX-B-A-B)n-BOX-B-A-B??Formula (II) wherein, A includes a hydrophilic polyethylene glycol polymer, B includes a hydrophobic polyester polymer, BOX is a bifunctional group monomer of 2, 2?-Bis(2-oxazoline) and used for coupling the blocks A-B or B-A-B, and n is an integer and the same or more than 0.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: December 24, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Shen-Hua Peng, Hsin-Hsin Shen, Liang-Yo Yang, Meng-Yow Hsieh, Pei-Shan Li, Wei-Lin Yu, Tsai-Yu Lin, Po-Liang Lai, Jui-Sheng Sun, Chih-Hung Chang, Yi-Hung Lin
  • Patent number: 8309623
    Abstract: The disclosed is a biodegradable copolymer, an amphiphilic diblock copolymer, composed of a hydrophilic segment and a hydrophobic segment. The hydrophilic segment is an endcapped PEG or derivatives thereof. The hydrophilic segment is a random polymer polymerized of lactone or cyclic C3-C6 molecule and lactic acid/glycolic acid. There is no coupling agent between the hydrophilic and hydrophobic segments, and the biodegradable copolymer is formed by one-pot ring-opening polymerization. The biodegradable copolymer can be dissolved in water to form a thermosensitive material having a phase transfer temperature of 25 to 50° C., thereby being applied to biological activity factor delivery, tissue engineering, cell culture and biological glue.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: November 13, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Ya-Jen Yu, Chin-Fu Chen, Tsai-Yu Lin, Shao-Jen Yeh, Shian-Yih Wang, Po-Liang Lai
  • Patent number: 8124128
    Abstract: An amphiphilic block copolymer. The amphiphilic block copolymer includes one or more hydrophilic polymers, one or more hydrophobic polymer, and one or more zwitterions. The invention also provides a nano particle and carrier comprising the amhpiphilic block copolymer for delivery of water-insoluble drugs, growth factors, genes, or cosmetic substances.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: February 28, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Fa Hsieh, Hsuen-Tseng Chang, Chin-Fu Chen, Yuan-Chia Chang, Pei Kan, Tsai-Yu Lin, Yuan-Hung Hsu
  • Publication number: 20120045511
    Abstract: A thermosensitive hepatitis B vaccine is provided. The thermosensitive hepatitis B vaccine includes an aqueous phase solution comprising a biodegradable thermosensitive hydrogel copolymer; a surface antigen of hepatitis B virus (HBsAg); and a bioactive substance. The thermosensitive hepatitis B vaccine of the disclosure is particularly suitable for being applied in the patients, which are low responsive or non-responsive to conventional hepatitis B vaccine, for enhancing the induction of cell-mediated immune responses and overcoming the HBsAg non-responsiveness.
    Type: Application
    Filed: August 17, 2010
    Publication date: February 23, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Mi-Hua Tao, Ho-Yuan Chou, Hsin-Hsin Shen, Tsai-Yu Lin
  • Publication number: 20120010139
    Abstract: Thermal responsive compositions for treating bone diseases are provided. The thermal responsive composition for treating bone diseases includes a bone growth factor and a biodegradable copolymer. The biodegradable copolymer has a structure of Formula (I) or Formula (II): A-B-BOX-B-A??(Formula I) and B-A-B-(BOX-B-A-B)n-BOX-B-A-B??Formula (II), wherein, A includes a hydrophilic polyethylene glycol polymer, B includes a hydrophobic polyester polymer, BOX is a bifunctional group monomer of 2,2?-Bis(2-oxazoline) and used for coupling the blocks A-B or B-A-B, and n is an integer and the same or more than 0.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 12, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shen-Hua Peng, Hsin-Hsin Shen, Liang-Yo Yang, Meng-Yow Hsieh, Pei-Shan Li, Wei-Lin Yu, Tsai-Yu Lin, Po-Liang Lai, Jui-Sheng Sun, Chih-Hung Chang, Yi-Hung Lin
  • Publication number: 20110065829
    Abstract: The disclosed is a biodegradable copolymer, an amphiphilic diblock copolymer, composed of a hydrophilic segment and a hydrophobic segment. The hydrophilic segment is an endcapped PEG or derivatives thereof. The hydrophilic segment is a random polymer polymerized of lactone or cyclic C3-C6 molecule and lactic acid/glycolic acid. There is no coupling agent between the hydrophilic and hydrophobic segments, and the biodegradable copolymer is formed by one-pot ring-opening polymerization. The biodegradable copolymer can be dissolved in water to form a thermosensitive material having a phase transfer temperature of 25 to 50° C., thereby being applied to biological activity factor delivery, tissue engineering, cell culture and biological glue.
    Type: Application
    Filed: November 23, 2010
    Publication date: March 17, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ya-Jen YU, Chin-Fu CHEN, Tsai-Yu LIN, Shao-Jen YEH, Shian-Yih WANG, Po-Liang LAI
  • Patent number: 7884142
    Abstract: The disclosed is a biodegradable copolymer, an amphiphilic diblock copolymer, composed of a hydrophilic segment and a hydrophobic segment. The hydrophilic segment is an endcapped PEG or derivatives thereof. The hydrophilic segment is a random polymer polymerized of lactone or cyclic C3-C6 molecule and lactic acid/glycolic acid. There is no coupling agent between the hydrophilic and hydrophobic segments, and the biodegradable copolymer is formed by one-pot ring-opening polymerization. The biodegradable copolymer can be dissolved in water to form a thermosensitive material having a phase transfer temperature of 25 to 50° C., thereby being applied to biological activity factor delivery, tissue engineering, cell culture and biological glue.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: February 8, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Ya-Jen Yu, Chin-Fu Chen, Tsai-Yu Lin, Shao-Jen Yeh, Shian-Yih Wang, Po-Liang Lai
  • Publication number: 20090247666
    Abstract: The disclosed is a biodegradable copolymer, an amphiphilic diblock copolymer, composed of a hydrophilic segment and a hydrophobic segment. The hydrophilic segment is an endcapped PEG or derivatives thereof. The hydrophilic segment is a random polymer polymerized of lactone or cyclic C3-C6 molecule and lactic acid/glycolic acid. There is no coupling agent between the hydrophilic and hydrophobic segments, and the biodegradable copolymer is formed by one-pot ring-opening polymerization. The biodegradable copolymer can be dissolved in water to form a thermosensitive material having a phase transfer temperature of 25 to 50° C., thereby being applied to biological activity factor delivery, tissue engineering, cell culture and biological glue.
    Type: Application
    Filed: February 27, 2009
    Publication date: October 1, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ya-Jen Yu, Chin Fu Chen, Tsai-Yu Lin, Shao-Jen Yeh, Shian-Yih Wang, Po-Liang Lai
  • Publication number: 20070104654
    Abstract: An amphiphilic block copolymer. The amphiphilic block copolymer includes one or more hydrophilic polymers, one or more hydrophobic polymer, and one or more zwitterions. The invention also provides a nano particle and carrier comprising the amhpiphilic block copolymer for delivery of water-insoluble drugs, growth factors, genes, or cosmetic substances.
    Type: Application
    Filed: November 8, 2005
    Publication date: May 10, 2007
    Inventors: Ming-Fa Hsieh, Hsuen-Tseng Chang, Chin-Fu Chen, Yuan-Chia Chang, Pei Kan, Tsai-Yu Lin
  • Patent number: D798763
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: October 3, 2017
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tsai-Yu Lin, Jyh-Chyang Tzou, Hsin Yeh, Yuan-Ping Chu, Yao-Tsung Yeh
  • Patent number: D798764
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: October 3, 2017
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tsai-Yu Lin, Jyh-Chyang Tzou, Hsin Yeh, Yuan-Ping Chu, Yao-Tsung Yeh