Abstract: A method for transferring objects and a transfer apparatus using the same are provided. The method includes the following steps: controlling, during a first period, the ejector at an ejecting working position to perform an ejecting process along with a first direction, to transfer the object from the first substrate to the second substrate; controlling, during a second period, the ejector to move to an ejecting standby position along with a second direction which is non-parallel to the first direction, to expose at least one of the object on the first substrate to a detection range of an image capturing device; detecting the position of the object in the detection range to obtain calibration information; and adjusting the position of the first substrate according to the calibration information.

Abstract: A method of integration testing for packaged electronic components is capable of improving a conventional testing for packaged electronic components. In this method, non-tested sides of the packaged electronic components are stuck with a downward exposure onto a testing carrier board so that conductive pins are oriented to test spaces to test the plurality of packaged electronic components stuck onto the testing carrier board according to testing steps for convenient classification packaging, advanced testing efficiency, economical working hours and costs. Programmable features and man-hour saving are provided for easy mass production and testing.

Abstract: A mass-production LED test device includes a control module, at least one integrating sphere module electrically connected to the control module and at least one test board corresponding to at the least one integrating sphere module. The integrating sphere module has an electrical output entrance, an optical output entrance and an optical input entrance. The test board has a plurality of pads to which a plurality of LEDs are electrically connected, respectively, for supplying required current of each LED. The optical input entrance of the integrating sphere module defines a predetermined measure for containing a predetermine amount of the LEDs at one time. The integrating sphere module has a plurality of probes corresponding to the predetermine amount of the LEDs, thereby to test the electrical character of each LED by a manner of one by one.

Abstract: A method of integration testing for packaged electronic components is capable of improving a conventional testing for packaged electronic components. In this method, non-tested sides of the packaged electronic components are stuck with a downward exposure onto a testing carrier board so that conductive pins are oriented to test spaces to test the plurality of packaged electronic components stuck onto the testing carrier board according to testing steps for convenient classification packaging, advanced testing efficiency, economical working hours and costs. Programmable features and man-hour saving are provided for easy mass production and testing.