Patents by Inventor Tsan-Hua Tung
Tsan-Hua Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10964594Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: GrantFiled: December 18, 2018Date of Patent: March 30, 2021Assignee: Taiwan Semiconductor Manufacturing Company.Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Publication number: 20190122929Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: ApplicationFiled: December 18, 2018Publication date: April 25, 2019Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Patent number: 10163711Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: GrantFiled: June 5, 2017Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Publication number: 20170271209Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: ApplicationFiled: June 5, 2017Publication date: September 21, 2017Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Patent number: 9673098Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: GrantFiled: August 1, 2016Date of Patent: June 6, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Publication number: 20160343615Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: ApplicationFiled: August 1, 2016Publication date: November 24, 2016Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Patent number: 9406581Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: GrantFiled: August 24, 2015Date of Patent: August 2, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Patent number: 9312148Abstract: A method of packaging a semiconductor device includes forming an insulating layer over a semiconductor device, wherein the semiconductor device has a contact pad, and a thickness of the contact pad is greater than a thickness of the insulating layer. The method further includes forming a molding compound to cover the semiconductor device and a space between the semiconductor device and a neighboring semiconductor device, wherein both semiconductor devices are on a carrier wafer. The method further includes planarizing a surface of the semiconductor device by removing the molding compound and the insulating layer over the contact pad.Type: GrantFiled: March 16, 2015Date of Patent: April 12, 2016Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Yi-Chao Mao, Wan-Ting Shih, Tsan-Hua Tung
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Publication number: 20150364395Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: ApplicationFiled: August 24, 2015Publication date: December 17, 2015Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Patent number: 9117682Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: GrantFiled: October 11, 2011Date of Patent: August 25, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Publication number: 20150187605Abstract: A method of packaging a semiconductor device includes forming an insulating layer over a semiconductor device, wherein the semiconductor device has a contact pad, and a thickness of the contact pad is greater than a thickness of the insulating layer. The method further includes forming a molding compound to cover the semiconductor device and a space between the semiconductor device and a neighboring semiconductor device, wherein both semiconductor devices are on a carrier wafer. The method further includes planarizing a surface of the semiconductor device by removing the molding compound and the insulating layer over the contact pad.Type: ApplicationFiled: March 16, 2015Publication date: July 2, 2015Inventors: Jing-Cheng LIN, Jui-Pin HUNG, Nai-Wei LIU, Yi-Chao MAO, Wan-Ting SHIH, Tsan-Hua TUNG
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Patent number: 9000584Abstract: The mechanisms of forming a molding compound on a semiconductor device substrate to enable fan-out structures in wafer-level packaging (WLP) are provided. The mechanisms involve covering portions of surfaces of an insulating layer surrounding a contact pad. The mechanisms improve reliability of the package and process control of the packaging process. The mechanisms also reduce the risk of interfacial delamination, and excessive outgassing of the insulating layer during subsequent processing. The mechanisms further improve planarization end-point. By utilizing a protective layer between the contact pad and the insulating layer, copper out-diffusion can be reduced and the adhesion between the contact pad and the insulating layer may also be improved.Type: GrantFiled: December 28, 2011Date of Patent: April 7, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Yi-Chao Mao, Wan-Ting Shih, Tsan-Hua Tung
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Publication number: 20130168848Abstract: The mechanisms of forming a molding compound on a semiconductor device substrate to enable fan-out structures in wafer-level packaging (WLP) are provided. The mechanisms involve covering portions of surfaces of an insulating layer surrounding a contact pad. The mechanisms improve reliability of the package and process control of the packaging process. The mechanisms also reduce the risk of interfacial delamination, and excessive outgassing of the insulating layer during subsequent processing. The mechanisms further improve planarization end-point. By utilizing a protective layer between the contact pad and the insulating layer, copper out-diffusion can be reduced and the adhesion between the contact pad and the insulating layer may also be improved.Type: ApplicationFiled: December 28, 2011Publication date: July 4, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jing-Cheng LIN, Jui-Pin HUNG, Nai-Wei LIU, Yi-Chao MAO, Wan-Ting SHIH, Tsan-Hua TUNG
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Publication number: 20130087916Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.Type: ApplicationFiled: October 11, 2011Publication date: April 11, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
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Publication number: 20120153520Abstract: The invention discloses the synthesis of a new-type chitosan-based hybrid macromolecule and a method for producing or using the macromolecule. This macromolecule comprises an amphiphatic chitosan and a silicon-based coupling agent that is anchored by a chemical bonding. The method for producing the hybrid macromolecule can be easily operated under ambient environment. The produced macromolecule can be self-assembled in an aqueous environment to form a nanocarrier, and has the ability to efficiently encapsulate drugs for a subsequent sustained release purpose. This self-assembled hybrid nanocarrier demonstrated features of excellent biocompatibility, drug loading ability and cellular uptake efficiency.Type: ApplicationFiled: May 5, 2011Publication date: June 21, 2012Inventors: Dean-Mo LIU, Tsan-Hua Tung, Hongwei Cheng