Abstract: The present invention provides an LED fluorescent tube. In this LED fluorescent tube, at least one flexible PCB is particularly used for carrying the LED driving unit, wherein the flexible PCB can be accommodated in end caps of the LED fluorescent tube by a bend form. Thus, because the size of the end caps is minimized due to such arrangement, the illumination range of the LED fluorescent tube is therefore increased. Moreover, by the use of the flexible PCB, the inner structure of the end cap does be simplified, so as to make the production difficulty and manufacturing cost of the LED fluorescent tube be largely reduced.

Abstract: The present invention provides an omni-directional LED bulb lamp, wherein the omni-directional LED bulb lamp mainly consists of: a main body, a standard connector, a LED disposing body, a copper circuit layer, an anti-soldering layer, a plurality of LED chips, and a cover. Particularly, the LED disposing body is designed to comprise a main disposing portion, a first folding portion and a second folding portion; moreover, the first folding portion and the main disposing portion have a first included angle, and the second folding portion and the first folding portion have a second included angle. By such design, when the LED chips disposed on the main disposing portion, the first folding portion and the second folding portion emit light, the illumination range of the emitted light is able to be greater than 270°.

Abstract: The present invention relates to a LED panel lighting device, comprising: a back framework, an assembled housing, at least two circuit layer, a plurality of LED chips, a light guide plate, a bottom reflective member, and an optical diffusion member, wherein the assembled housing is consisted of a plurality of housing edges, and the circuit layers are disposed in the housing edges via a thermal conductive and electric insulating member, so as to be disposed with the LED chips. In the present invention, it mainly disposes the circuit layers with the LED chips into the housing edges by the thermal conductive and electric insulating member, without using any MCPCBs. Therefore, comparing to the conventional LED panel lighting device, this LED panel lighting device would not produce any heat accumulation issue because the MCPCB does not used in this LED panel lighting device.

Abstract: The present invention relates to a double-layer circuit structure with high heat-dissipation efficiency, comprising: a first thermal-conductive and electric-insulating layer, a plurality of first metal pads, a second thermal-conductive and electric-insulating layer, a circuit layer, and an anti-soldering layer. In the double-layer circuit structure, the second thermal-conductive and electric-insulating layer disposed on the first thermal-conductive and electric-insulating layer has a plurality of openings, and a plurality of second metal pads of the circuit layer on the second thermal-conductive and electric-insulating layer are connected with the openings, respectively. Thus, after each of devices to be welded are soldered on two second metal pads, the solder would flow into the openings through the soldering points between the devices to be welded and the second metal pads, so as to sequentially flow onto the first metal pads.

Abstract: LED backlight module structure for increasing process yield comprises a housing, a copper circuit layer, a plurality of LED chips, a plurality of solder paste overflow prevention members, a light guide plate, and a bottom reflector. In the present invention, it mainly disposed the solder paste overflow prevention members between the LED chips and the copper circuit layer, therefore, the solder paste overflow phenomenon is prevented when using a pressing fixture to assist in executing the welding process of LED chips, and it ensures that the soldering pins of the LED chips would not electrically connect to each other due to the solder paste overflow phenomenon. Moreover, a position limiting band can be further disposed on the copper circuit layer for receiving and fixing the LED chips, in addition, the position limiting band is helpful to the LED chips in heat dissipation when the LED chips emit light.

Abstract: LED backlight module structure for increasing process yield comprises a housing, a copper circuit layer, a plurality of LED chips, a plurality of solder paste overflow prevention members, a light guide plate, and a bottom reflector. In the present invention, it mainly disposed the solder paste overflow prevention members between the LED chips and the copper circuit layer, therefore, the solder paste overflow phenomenon is prevented when using a pressing fixture to assist in executing the welding process of LED chips, and it ensures that the soldering pins of the LED chips would not electrically connect to each other due to the solder paste overflow phenomenon. Moreover, a position limiting band can be further disposed on the copper circuit layer for receiving and fixing the LED chips, in addition, the position limiting band is helpful to the LED chips in heat dissipation when the LED chips emit light.

Abstract: The present invention relates to a backlight module having housing provided with groove structure, wherein the backlight module comprises: a housing, a plurality of LED chips, a thermal conductive layer, a reflector, and a light guide plate. In which, the housing has a groove formed on a housing bottom thereof, and the circuit layer is disposed in the groove through a first thermally conductive insulating layer. In addition, the plurality of LED chips are disposed in the housing and welded on the circuit layer. In the present invention, the circuit layer and the LED chips are disposed in the groove of the housing, therefore, when mass producing the backlight module, it is able to ensure that the position of LED chips would correspond to the circuit layer in the housing, such that each the backlight module manufactured by mass production can be used for providing a stable light source.

Abstract: The present invention relates to an improved LED backlight module, which is disposed on a main frame installed in a liquid crystal display device, and comprises: a supporting body, a copper circuit layer, a plurality of LED chips, a plurality of extended thermal-conductivity layers, a light guide plate, and a bottom reflecting member. In the present invention, it mainly connects the plurality of extended thermal-conductivity layers to a plurality of the soldering points of the copper circuit layer, and attaches a majority of the extended thermal-conductivity layers to the surface of the bottom plate of the main frame through an insulating and thermal-conductivity adhesive; So that, when the LED chips emit the light, the soldering points conduct the heat produced by the LED chips to the extended thermal-conductivity layers, so as to evenly distribute the heat over the surface of the bottom plate through the extended thermal-conductivity layers.

Abstract: The present invention relates to a backlight module having housing provided with groove structure, wherein the backlight module comprises: a housing, a plurality of LED chips, a thermal conductive layer, a reflector, and a light guide plate. In which, the housing has a groove formed on a housing bottom thereof, and the circuit layer is disposed in the groove through a first thermally conductive insulating layer. In addition, the plurality of LED chips are disposed in the housing and welded on the circuit layer. In the present invention, the circuit layer and the LED chips are disposed in the groove of the housing, therefore, when mass producing the backlight module, it is able to ensure that the position of LED chips would correspond to the circuit layer in the housing, such that each the backlight module manufactured by mass production can be used for providing a stable light source.

Abstract: The present invention relates to a backlight module with connecting circuits, comprising: at least one main circuit lay, a first connecting circuit layer and a second connecting circuit layer, wherein the first connecting circuit layer and the second connecting circuit layer can be connected with the main circuit layer by way of a second time welding process, therefore the total circuit area of the backlight module is increased. Moreover, in the backlight module with connecting circuits, a plurality of first holes are form on a housing, and the first holes sink from the outer surface to the inner surface of the housing bottom, such that each of the LED chips are snugly covered by the inner walls of the first holes when they respectively enter the first holes; Therefore, when the LED chips emit the light, the heat produced by each of the surfaces of the LED chips can be rapidly conducted to the housing via the inner walls of the first holes, and then the heat may be dissipated through the housing.

Abstract: The present invention relates to a backlight module with three-dimensional circuit structure, comprising: a housing, a thermal conductive material, a three- dimensional circuit module, a plurality of light-emitting devices, a reflective layer, a light guide plate, and a thermal conductive layer, wherein a main body of the three- dimensional circuit module has a plurality of concave holes in the surface thereof, and a three-dimensional circuit layer is disposed on the surface of the main body, the side walls of the plurality of concave holes, and the bottoms of the concave holes; in addition, the light-emitting devices are respectively disposed in the concave holes by way of being welded on the welding points; Therefore, the complete circuit can be disposed in the limit-sized main body, so that, the backlight module with three-dimensional circuit structure can be applied to a thin liquid crystal display device.

Abstract: The present invention relates to a backlight module with three-dimensional circuit structure and extrusion housing, comprising: an extrusion housing, a three-dimensional circuit layer, a plurality of light-emitting devices, a reflective layer, a light guide plate, and a thermal conductive layer, wherein an installation portion of the extrusion housing has a plurality of concave holes in the first surface thereof, and the three-dimensional circuit layer is disposed on the first surface of the installation portion, the side walls of the plurality of concave holes, and the bottoms of the concave holes; Thus, the complete circuit can be disposed in the limited-sized installation portion; Moreover, moreover, the three-dimensional circuit layer further has a plurality of welding points disposed on the bottoms of the concave holes, such that the light-emitting devices can be respectively disposed in the concave holes by way of being welded on the welding points; So that, when the liquid crystal display device is hit

Abstract: The present invention relates to an LED backlight module having extrusion housing, comprising: an extrusion housing, a circuit layer, a thermal conductive band, an accommodating body, a plurality of LED chips, a first elastic thermal-conductive member, and second elastic thermal-conductive member, wherein the accommodating body has a plurality of through holes for receiving the LED chips, such that the LED chips disposed on the circuit layer can pass through the through holes, respectively, therefore, the LED chips accommodated in the through holes are protected from suffering the impact caused by an external force; Moreover, through the thermal conductive band, the first elastic thermal-conductive member and the second elastic thermal-conductive member, when the LED chips emit light, the heat produced by the LED chips can be effectively dissipated via “double-direction dissipation”, that is, the heat can be dissipated via the front surface and the rear surface of the circuit layer.

Abstract: The present invention relates to an integrated backlight module with good heat equalization and heat dissipation performance, comprising: a main frame, a welded material, a thermal conductive medium, and at least one light source module, wherein the main frame has at least one edge for disposing the light source module and has good heat dissipation property. The light source module comprises: a reflective member, a copper circuit layer and a plurality of LED chips, wherein the light source module attached with a thermal conductive adhesion is attached to the edge of the main frame via the thermal conductive medium; besides, the welded material is used for steadily combining the thermal conductive medium with the edge.

Abstract: The present invention relates to an improved LED lighting device with good heat dissipation, comprising: a housing; a copper circuit layer, disposed on the housing; a plurality of LED chips, disposed on the copper circuit layer; and a white reflective member, disposed on the plurality of LED chips and the copper circuit layer, wherein the white reflective member is used to increase the light-emitting efficiencies of the LED chips. In the present invention, the copper circuit layer is directly disposed on the housing without using an aluminum substrate or a print circuit board, so that the cost of the improved LED lighting device is reduced; moreover, that also prevents the LED chips from damage when welding the LED chips, and makes the improved LED lighting device performing better heat dissipation property.

Abstract: The present invention relates to an improved edge-type LED backlight module, comprising: a cover, a printed circuit board (PCB), a plurality of LEDs, a reflective member, a light guide plate (LGP), and a bottom reflective member, wherein the PCB, the plurality of LEDs, and the reflective member are disposed in the cover, the reflective member is used for reflecting a light emitted by the LEDs. A light incident surface of the LGP having a plurality of concave arc-shaped surfaces which are opposite to the plurality of LEDs, respectively, so that, when the light incident into the light incident surface, the light can be extended by the concave arc-shaped surfaces and evenly distributed in the LGP 15; moreover, after the light incident the LGP, the bottom reflective member is able to avoid the light leakage occurring in one side surface of the LGP.

Abstract: A lamp shade structure applied to a liquid crystal display backlight module includes a metal hood, an adhesive layer and a reflective sheet, wherein the metal hood is formed by bending a metal sheet into a cross-sectional shape and has a containing space formed at an internal side of the metal hood, the cross-section of the reflective sheet is in an arc shape, and a side of the reflective sheet is attached to the containing space through the adhesive layer. Since the cross-section of the reflective sheet is in an arc shape, therefore the present invention can improve the reflecting efficiency of the lamp shade structure effectively.

Abstract: A heat dissipating structure of a backlight module includes two light emitting portions and a backlight portion having a light guide plate, a back reflector and a metal clad. The light guide plate is connected to the back reflector. A dent is formed and attached to the light guide plate. The back reflector is connected to the metal clad. Each light emitting portion includes a metal cover, a lamp cup reflector, at least one lamp tube and lamp holders. The lamp cup reflector is attached to the metal cover. A containing groove is formed at the lamp cup reflector and contains the lamp tubes and lamp holders. A thermal conducting plate is extended from the metal cover and contacted with the metal clad. Thus, the heat produced by the lamp tube can be conducted to the metal clad through the lamp holder and the metal cover for heat dissipation.

Abstract: A lamp reflector structure includes a metal hood, an adhesive layer and a reflecting plate. The structure is applied to a backlight module of a liquid crystal display, and the metal hood is made by bending a metal plate into a first cross-sectional shape and forms a containing space in the metal hood and dents on the reflecting plate, such that the reflecting plate can be bent to a position corresponding to the dents and into a second cross-sectional shape. A portion of the reflecting plate not corresponding to the dents is attached into the containing space through the adhesive layer, and each bent position of the metal hood is disposed proximate to each dent of the reflecting plate. The reflecting plate is thinner at positions corresponding to the dents, but the remaining portion maintains an even thickness to enhance the reflection index of the lamp reflector structure.

Abstract: The present invention discloses a heat sink assembly comprising a plurality of heat sinks having the same shape and being latched by at least one fixing bar, so that the heat sinks and the fixing bar can be connected together to form the heat sink assembly, enabling each heat sink to be placed individually onto a flat surface and be erected securely on the flat surface without falling down.