Abstract: A portable computer system includes a portable computer and an integrated device both having wireless data transmission interface. The integrated device is connected to various peripheral devices with different interfaces and controlled by corresponding external port signals. When the portable computer wants to access the peripheral devices, a signal processor integrates and encodes all the external port signals to generate a single encoded signal to be fed to the integrated devices via the wireless transmission interface. After the integrated device receives the encoded signal, a signal processor decodes it to reproduce individual external port signals to be transferred to each corresponding peripheral device to control the operation thereof. During the encoding process, the signal processor may set the priorities according to the properties of each signal and add the identification information of the portable computer.

Abstract: A function module with built-in heat dissipation device. The function module includes a first circuit board, a second circuit board, a first height-compensation heat spreader, a second height-compensation heat spreader, and a heat dissipation fin. The first circuit board has a first surface, a first and second device. The second circuit board has a second surface facing the first surface, a third device, and a fourth device. The first height-compensation heat spreader has a first face, contacting the first and second devices simultaneously, and a third face, opposite to the first face. The second height-compensation heat spreader has a second face, contacting the third and fourth devices simultaneously, and a fourth face, opposite to the second face. The heat dissipation fin is disposed between the first circuit board and the second circuit board.

Abstract: A function module with a built-in heat dissipation fin. The function module includes a first circuit board, a second circuit board, and a heat dissipation fin. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The heat dissipation fin is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

Abstract: A function module with a built-in plate-type heat dissipation device. The function module includes a first circuit board, a second circuit board, and a plate-type heat dissipation device. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The plate-type heat dissipation device is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

Abstract: A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.