Patents by Inventor Tsan-Wen Chuang

Tsan-Wen Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140196285
    Abstract: A method for making a heat column includes a step of preparing a section of a metal object; a step of forging the section of the metal object to be a hollow column which has a flat bottom, a guide surface being formed in the inner periphery of the hollow column, the hollow column having a flat bottom which has a heat-exchange surface; a step of making a neck on one end of the hollow column, and a step of sealing the neck by way of welding when the interior of the hollow column is sucked to be substantial vacuum status, liquid high heat transmission agent being introduced into the interior of the hollow column. The flat bottom is integral formed when the hollow column is formed and the flat bottom is in contact with the heat source.
    Type: Application
    Filed: January 11, 2013
    Publication date: July 17, 2014
    Applicant: NTIS ENTERPRISE CO., LTD.
    Inventors: Chien-Shun Chao, Tsan-Wen Chuang, Chun-Hsiang Chan, Shih-Chih Liu, Chun-Nan Liu
  • Patent number: 6662412
    Abstract: A buckle of an IC heat dissipating device for installing a heat dissipating fin device to a top surface of an IC located in an IC socket comprises a pair of clamping arms; a supporting frame being fixed to a top of the heat dissipating fin device; and an operation rod having a camshaft and a lever for rotating the camshaft. The camshaft passes through the supporting frame and is capable of rotating freely. In operation position, the cam of the camshaft will eject the pivotal connection of the clamping arms and the clamping arms will bend and deform. By the restoring force of these clamping arms, the ears at two ends of the clamping arms have sufficient forces to hook the hooks at two sides of the IC socket. In installing the present invention, the user only needs to press an operation portion slightly.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: December 16, 2003
    Inventors: Tsan-Wen Chuang, Jr. Chou
  • Publication number: 20030024081
    Abstract: A buckle of an IC heat dissipating device for installing a heat dissipating fin device to a top surface of an IC located in an IC socket comprises a pair of clamping arms; a supporting frame being fixed to a top of the heat dissipating fin device; and an operation rod having a camshaft and a lever for rotating the camshaft. The camshaft passes through the supporting frame and is capable of rotating freely. In operation position, the cam of the camshaft will eject the pivotal connection of the clamping arms and the clamping arms will bend and deform. By the restoring force of these clamping arms, the ears at two ends of the clamping arms have sufficient forces to hook the hooks at two sides of the IC socket. In installing the present invention, the user only needs to press an operation portion slightly.
    Type: Application
    Filed: January 10, 2002
    Publication date: February 6, 2003
    Inventors: Tsan-Wen Chuang, Chou
  • Patent number: D464939
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: October 29, 2002
    Assignee: Thermal Integration Technology Inc.
    Inventors: Tsan-Wen Chuang, Jr. Chou