Abstract: A lead frame includes a main plate and a side plate. The main plate has a support portion and a projecting portion. The support portion has two opposite first sides and a support face located between the first sides. The projecting portion projects upward from one of the first sides in a direction opposite to the support face. The side plate is disposed separately from the one of the first sides of the support portion and is spaced apart from the projecting portion.

Abstract: A wearable apparatus and a photoplethysmograph (PPG) sensor unit are provided. The wearable apparatus includes a wearable holder and a physiological information measurement module configured to the wearable holder. The physiological information measurement module includes a circuit board, an electrocardiograph (ECG) sensor unit and a PPG sensor unit. The PPG sensor unit is disposed on the circuit board and adapted to be used in conjunction with the ECG sensor unit electrically connected to a first pad and a second pad on the circuit board. The PPG sensor unit includes a grid having a plurality of accommodating spaces, a lighting element arranged in one of the accommodating spaces, and a photo sensor arranged in another accommodating space. The grid includes an inner conductive contact portion exposed from the wearable holder, facing an inner side of the wearable holder and electrically connected to the second pad.

Abstract: A lead frame includes a main plate and a side plate. The main plate has a support portion and a projecting portion. The support portion has two opposite first sides and a support face located between the first sides. The projecting portion projects upward from one of the first sides in a direction opposite to the support face. The side plate is disposed separately from the one of the first sides of the support portion and is spaced apart from the projecting portion.

Abstract: An optical biosensor module includes a circuit board having a mounting surface and first and second circuits. A light-receiving unit is disposed on the mounting surface, and includes a light receiver electrically connected to the first circuit and having a light-receiving surface. A light-emitting unit is disposed on the light-receiving surface, and includes a light emitter electrically connected to the second circuit and having a light-emitting surface, and a light emitter blocking wall surrounding the light emitter. An opaque interface exists between the light receiver and the light emitter, and a top side of the light emitter blocking wall is equal to or higher than the light-emitting surface.

Abstract: An optical sensor module has a light receiver and a light-emitter which is surrounded by a light blocking wall, wherein the light receiver is disposed on a main plate and the light-emitter is disposed on a side plate separately from the main plate. The light blocking wall is formed as a light barrier wall between the light receiver and the light-emitter. A projecting portion projecting upward from the main plate is enclosed by the light barrier wall, and a top face of the projecting portion is higher than the light receiving face and the light-emitting face.

Abstract: An optical biosensor module includes a circuit board having a mounting surface and first and second circuits. A light-receiving unit is disposed on the mounting surface, and includes a light receiver electrically connected to the first circuit and having a light-receiving surface. A light-emitting unit is disposed on the light-receiving surface, and includes a light emitter electrically connected to the second circuit and having a light-emitting surface, and a light emitter blocking wall surrounding the light emitter. An opaque interface exists between the light receiver and the light emitter, and a top side of the light emitter blocking wall is equal to or higher than the light-emitting surface.

Abstract: An optical sensor module has a light receiver and a light-emitter which is surrounded by a light blocking wall, wherein the light receiver is disposed on a main plate and the light-emitter is disposed on a side plate separately from the main plate. The light blocking wall is formed as a light barrier wall between the light receiver and the light-emitter. A projecting portion projecting upward from the main plate is enclosed by the light barrier wall, and a top face of the projecting portion is higher than the light receiving face and the light-emitting face.

Abstract: A wearable apparatus and a photoplethysmograph (PPG) sensor unit are provided. The wearable apparatus includes a wearable holder and a physiological information measurement module configured to the wearable holder. The physiological information measurement module includes a circuit board, an electrocardiograph (ECG) sensor unit and a PPG sensor unit. The PPG sensor unit is disposed on the circuit board and adapted to be used in conjunction with the ECG sensor unit electrically connected to a first pad and a second pad on the circuit board. The PPG sensor unit includes a grid having a plurality of accommodating spaces, a lighting element arranged in one of the accommodating spaces, and a photo sensor arranged in another accommodating space. The grid includes an inner conductive contact portion exposed from the wearable holder, facing an inner side of the wearable holder and electrically connected to the second pad.

Abstract: An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 ?m to 10 ?m and a depth of less than or equal to 50 ?m.

Abstract: An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 ?m to 10 ?m and a depth of less than or equal to 50 ?m.

Abstract: A liquid crystal display (LCD) panel and a fabricating method thereof are described. First, a first substrate and a second substrate are provided. A liquid crystal monomer layer is then formed on the surface of at least one of the first and second substrates. Next, a curing step is performed to the liquid crystal monomer layer to induce a polymerization reaction, so as to form a liquid crystal polymer layer. Thereafter, the first and second substrates are assembled and a liquid crystal layer is filled between the first and second substrates.

Abstract: A liquid crystal display (LCD) panel and a fabricating method thereof are described. First, a first substrate and a second substrate are provided. A liquid crystal monomer layer is then formed on the surface of at least one of the first and second substrates. Next, a curing step is performed to the liquid crystal monomer layer to induce a polymerization reaction, so as to form a liquid crystal polymer layer. Thereafter, the first and second substrates are assembled and a liquid crystal layer is filled between the first and second substrates.

Abstract: A liquid crystal display (LCD) panel and a fabricating method thereof are described. First, a first substrate and a second substrate are provided. A liquid crystal monomer layer is then formed on the surface of at least one of the first and second substrates. Next, a curing step is performed to the liquid crystal monomer layer to induce a polymerization reaction, so as to form a liquid crystal polymer layer. Thereafter, the first and second substrates are assembled and a liquid crystal layer is filled between the first and second substrates.

Abstract: A fabrication method for a liquid crystal display. A pair of substrates is provided. An alignment layer is formed on the respective substrates. An energy beam is irradiated on a predetermined area of at least one of the alignment layers. The alignment layer is rubbed to form a first pretilt-angle area in the predetermined area exposed to the energy beam, and a second pretilt-angle area not exposed to the energy beam. The pair of substrates are bonded with a preset gap therebetween, and a liquid crystal layer is inserted between the substrates. The liquid crystals corresponding to the first pretilt angle area have a first pretilt angle of ?1, while those corresponding to the second pretilt angle area have a second pretilt angle of ?2.

Abstract: Structure for reducing the diffraction effect in periodic electrode arrangements and liquid crystal device including the same. The invention relates to a structure for reducing the diffraction effect in periodic electrode arrangements. The structure is used in a reflective or semi-transparent liquid crystal display with lateral electric fields. The light collecting efficiency is improved by using multiple (two or more) dielectric layers with different refractive index as passivation layers of transparent electrodes, and by adjusting thickness of each dielectric layer to obtain the same optical path between the passivation layers and the transparent electrodes when incident light is transmitted.

Abstract: A fabrication method for a liquid crystal display. A pair of substrates is provided. An alignment layer is formed on the respective substrates. An energy beam is irradiated on a predetermined area of at least one of the alignment layers. The alignment layer is rubbed to form a first pretilt-angle area in the predetermined area exposed to the energy beam, and a second pretilt-angle area not exposed to the energy beam. The pair of substrates are bonded with a preset gap therebetween, and a liquid crystal layer is inserted between the substrates. The liquid crystals corresponding to the first pretilt angle area have a first pretilt angle of ?1, while those corresponding to the second pretilt angle area have a second pretilt angle of ?2.