Patents by Inventor Tsang-I TSAI

Tsang-I TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240098953
    Abstract: This application discloses electromagnetic energy mitigation assemblies and automotive vehicle components comprising the electromagnetic energy mitigation assemblies. An electromagnetic energy mitigation assembly includes a first electrically conductive layer and a second electrically conductive layer. First and second permalloy layers are along respective first and second opposite sides of the first electrically conductive layer. Third and fourth permalloy layers are along respective third and fourth opposite sides of the second electrically conductive layer. An electromagnetic noise suppression layer is sandwiched between the second and third permalloy layers. An automotive vehicle component includes an electromagnetic energy mitigation assembly configured to be positioned relative to one or more batteries of an automotive vehicle for providing electromagnetic shielding for the one or more batteries. The electromagnetic energy mitigation assembly includes a first electrically conductive layer.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Tsang-I TSAI, Yunxi SHE, Dong-Xiang LI, Jie-Sheng CHEN, Min-Wei HSU
  • Patent number: 11731224
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: August 22, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Tsang-I Tsai, Yi-Shen Lin, Min-Wei Hsu, Chen-Xi Yu
  • Publication number: 20220186835
    Abstract: An electrically and thermally conductive gasket includes a resilient core including a plurality of sides, a heat spreader disposed along at least two sides of the plurality of sides of the resilient core, and an electrically conductive layer disposed along and/or covering at least a portion of the heat spreader, such that the portion of the heat spreader is between the resilient core and the electrically conductive layer. The gasket is positionable and/or compressible between first and second surfaces to thereby define an electrically conductive path and a thermally conductive path between the first and second surfaces.
    Type: Application
    Filed: November 23, 2021
    Publication date: June 16, 2022
    Inventors: Yi-Shen LIN, Min-Wei HSU, Tsang-I TSAI
  • Publication number: 20220023984
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Application
    Filed: October 8, 2021
    Publication date: January 27, 2022
    Inventors: Tsang-I TSAI, Yi-Shen LIN, Min-Wei HSU, Chen-Xi YU
  • Patent number: 11141823
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: October 12, 2021
    Assignee: Laird Technologies, Inc.
    Inventors: Tsang-I Tsai, Yi-Shen Lin, Min-Wei Hsu, Chen-Xi Yu
  • Publication number: 20190329367
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Application
    Filed: May 10, 2018
    Publication date: October 31, 2019
    Inventors: Tsang-I TSAI, Yi-Shen LIN, Min-Wei HSU, Chen-Xi YU