Patents by Inventor Tsang Kei Sun

Tsang Kei Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6662431
    Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: December 16, 2003
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hang Pao, Robert Loke Hang Lam, Tsang Kei Sun
  • Patent number: 6344785
    Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.
    Type: Grant
    Filed: August 6, 1997
    Date of Patent: February 5, 2002
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hang Pao, Robert Loke Hang Lam, Tsang Kei Sun
  • Patent number: 6320489
    Abstract: The electronic surface mount package according to the present invention includes a one piece construction package having end walls, a side wall and an open bottom; a plurality of toroid transformers carried within the package by a soft silicone material wherein the toroid transformers each have wires wrapped thereon; a plurality of terminal pins molded within and extending from the bottom of the package wherein each of the pins extend through a bottom portion of the side wall and have a notched post upon which the wires from said transformers are wrapped and soldered thereon, respectively; and wherein the end walls have a first height H1 to form a standoff or safe guard between the foot seating plane of the package and the terminal pins; and wherein the outer portion of the side wall extends between the end walls such that the side wall has a second height H2 which is less than said first height H1.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: November 20, 2001
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hang Pao, Robert Loke Hang Lam, Tsang Kei Sun
  • Patent number: 6297721
    Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking. A reinforcement beam is located laterally across the bottom of the package to provide mechanical strength for the case.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: October 2, 2001
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Tsang Kei Sun, Peter Loh Hang Pao, Robert Loke Hang Lam
  • Patent number: 6297720
    Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking. A reinforcement beam is located laterally across the bottom of the package to provide mechanical strength for the case.
    Type: Grant
    Filed: December 27, 1996
    Date of Patent: October 2, 2001
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Tsang Kei Sun, Peter Loh Hang Pao, Robert Loke Hang Lam
  • Patent number: 6171151
    Abstract: An isolation module for an RJ-45 modular jack provides isolation and noise control and reduction for the RJ-45 modular jack. The RJ-45 modular jack includes a front surface having an opening for receiving a corresponding modular plug. The RJ-45 modular jack further includes a plurality of electrical fingers arranged in a spring bias fashion within the opening in the front surface for making electrical contact with a modular plug. The RJ-45 modular jack includes a series of sockets or slots along the back surface of said modular jack such that the electrical fingers extend to the back side of the modular jack and terminate in a reverse bent fashion to form a socket or clip portion within a respective socket or slot.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: January 9, 2001
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hung Pao, Robert Loke Hang Lam, Tsang Kei Sun
  • Patent number: 5656985
    Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: August 12, 1997
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hong Pao, Robert Lake Hang Lam, Tsang Kei Sun